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2022-09-24 22:06:10
MSK4301HD imported original genuine spot fake one penalty ten
MSK4301HD original factory official channels, guaranteed imported original genuine spot, fake one penalty ten, reasonable price-Yujixin Electronics
The MSK4301 is a three-phase MOSFET bridge plus driver in a convenient isolated hermetically sealed package. Hybrid is
Capable of outputting 29 amps and a DC bus voltage of 75 volts. It has a full range of protection features including
Biased undervoltage lockout protection, cross-conduction control, and user-programmable dead-time control
Shoot through the knockout. Additionally, the bridge can be turned off using the enable control. MSK 4301 offers
The MOSFETs have good thermal conductivity due to the electrically insulating package design that dissipates heat directly.
A device without an insulator.
feature:
Version 1 November 2010
three-phase alternating current
Induction Motor Control
HVAC Blower Control
29 amp, 75 volt, 3-phase MOSFET
smart bridge
Integrated gate drive
75V Motor Supply Voltage
29 Amp output switching capability, all N-channel MOSFET output bridges
100% duty cycle high side conduction
Suitable for PWM applications from DC to 100kHz
Shot Through/Cross Conduction Protection
Undervoltage Lockout Protection
Programmable Dead Time Control
Bridge Shutdown Control Low Active Enable
Isolation package design for high voltage isolation plus good heat transfer
Three lead bent plate options available
Contact MSK for MIL-PRF-38534 Eligibility Status
illustrate
The MSK4301 is a three-phase MOSFET bridge plus driver in a convenient isolated hermetically sealed package. Hybrid is
Capable of outputting 29 amps and a DC bus voltage of 75 volts. It has a full range of protection features including
Biased undervoltage lockout protection, cross-conduction control, and user-programmable dead-time control
Shoot through the knockout. Additionally, the bridge can be turned off using the enable control. MSK 4301 offers
The MOSFETs have good thermal conductivity due to the electrically insulating package design that dissipates heat directly.
A device without an insulator.