Shenzhen Datang Shengshi Semiconductor Co., Ltd.

Mobile: 17727572380

Tel: 0755-83226739

QQ:626839837

Address: 6F, Building 3, Saige Science and Technology Park, Huaqiang North, Futian District, Shenzhen

The OSD335x SM family of SiP products take full advantage of Texas Instruments' Sitara™_AM335x processors, allowing easy implementation of cost-effective systems based on these powerful chips. These SiPs integrate a TI AM335x processor, TPS65217C PMIC and TL5209 LDO, up to 1 GB DDR3 memory, 4 KB EEPROM for non-volatile configuration storage, and Resistors, Capacitors and Inductors.

This level of integration allows developers using the OSD335x-SM SiP family to focus on the necessary system functions without spending time on issues such as PMIC power distribution or high-speed DDR3 interfacing to the processor. This SiP greatly reduces time-to-market for AM335x-based products by reducing the overall size and complexity as well as the required supply chain.

The features and advantages are as follows:

TI AM335x features:

ARM?_Cortex?-A8, up to 1 GHz

8-channel 12-bit SAR ADC

Ethernet 10/100/1000 x 2

USB 2.0 HS OTG + PHY x2

MMC, SD and SDIO x3

LCD controller

SGX 3D graphics engine

PRU subsystem

TI AM335x, TPS65217C, TL5209, DDR3, EEPROM and passive components in a single package

Access to all AM335x peripherals: CAN, SPI, UART, I2C, GPIO, etc.

Up to 1 GB DDR3

Power Input: AC Adapter, USB or Single Cell (1S) Li-Ion/Li-Polymer Battery

Power output: 1.8 V, 3.3 V and SYS

Selectable AM335x I/O voltage: 1.8 V or 3.3 V

Integrates over 100 components in one package

Compatible with AM335x development tools and software

Wide BGA ball pitch enables low cost assembly

Significantly reduces design time

Reduce layout complexity

Board space is reduced by 60% compared to discrete_

Lower component count, higher reliability