The PT4205 is a continuous inductor current conduction mode step-down constant current source for driving one or more LEDs in series. The PT4205 has an input voltage range from 5V to 30V, has a 200mV±3 reference voltage, and the output current is set by an external resistor up to 1.2A. Depending on the output voltage and external components, the PT4205 can drive LEDs up to tens of watts.

PT4205 has a built-in power switch, uses high-end current sampling to set the average LED current, and the dedicated dimming terminal DIM pin can accept analog dimming and wide

range of PWM dimming. The built-in over-temperature protection function automatically reduces the LED current when the temperature is too high, which improves system reliability and avoids possible flickering problems in high-temperature operation. The PT4205 is available in SOT89-5 and ESOP-8 packages.

PT4205 features:

1. Few external components

2. Input voltage range 5V to 30V

3. The maximum output current is 1.2A

4.200mV±3% current reference

5. Multiplexing DIM pins for LED switching, analog dimming and PWM dimming

6. LED open circuit natural protection

7. Peak efficiency up to 97%_ 8. Over temperature soft protection to reduce flicker

9. ESOP8 package with enhanced heat dissipation can be used for high power drive

PT4205 application:

1. Low-voltage LED spotlights instead of halogen lamps

2. Car LED lights

3. LED backup light

4. LED signal lights

As is the case with the global electronics industry, the trend in medical electronics is toward smaller, lighter and more integrated solutions for mobile and portable medical applications. From portable electronic defibrillators to hand-held blood glucose monitors, mobility and portability have become major needs, driving the trend towards miniaturized, compact, low-power devices.

Molex offers some of the most innovative and smallest connector systems available on the market, including the SlimStack 0.40 mm pitch board-to-board interconnect system. Fiber-optic interconnection is also a major development trend. Molex has developed a fiber optic interconnect solution to meet the high reliability and performance needs of data-intensive market segments, including the medical industry. Here Molex offers a circular lensed MT beam expander interconnect solution.

Another trend in the medical industry is the use of fine-pitch flexible printed circuit (FPC) connectors, which provide features critical for tight packaging applications, and their compact size can save space, such as PC boards and space between LCD modules. Medical electronics will also require micro memory cards. Molex can supply an ultra-small 1.28mm high microSD memory card connector.

The medical sector will use Laser Directed Structuring (LDS) technology to realize a new type of Molded Interconnect Device (MID) that integrates PCB and connectors into a single component. Molex has developed an innovative Molded Interconnect Device/Laser Direct Structuring (MID/LDS) technology called MediSpec™.

Medical electronics will be increasingly networked, and data from devices, patients, treatment plans and complete systems will be kept in a central database. The emerging 100Gbps Ethernet as the primary data center interconnect technology requires a viable solution to enable parallel 28Gbps connections within high-density systems. Copper interconnect methods are experiencing severe limitations in reach, power consumption, thermal management and connection routing, which, combined with the cost of high-quality PCB materials, constitute a price-performance barrier. Optical interconnect methods will be an answer. In this regard, Molex is partnering with silicon photonics company Luxtera to enable high-density intra-system parallel 25-28Gbps connectivity.

Molex's SlimStack 0.40 mm pitch board-to-board system offers approximately 25% overall space savings compared to competing product types. Likewise, Molex's IllumiMate 2.00mm wire-to-board system offers the narrowest width of any comparable low-power connector system, along with significant cost and performance advantages.

In addition to saving space, FPC connectors feature Zero Insertion Force (ZIF) actuators that can be reused with minimal wear. Micro connectors are now available in a variety of fine pitch options, including push-pull and pop-up actuators. Certain products offer unique FPC locks to help provide positioning and cable routing and securing. In summary, FPC connectors provide flexibility and cost savings with an all-in-one solution, eliminating the need for mating connectors such as wire-to-board or board-to-board connectors.

Molex's ultra-small 1.28mm height microSD memory card connector reduces portable device memory card ejection and jamming issues. Molex has developed a variety of low temperature and high temperature plastic compounds using LDS technology. The compound can be molded in any conceivable structure and can be laser beam processed in all three dimensions. During direct laser structuring, chemical activation by ablation of the exposed polymer surface prepares it for proper copper adhesion in standard electroless plating processes. The established structures can act as electrical connectors on 3D-shaped components, eliminating the need for a 1D or 2D PCB. Soldering of mechanical contact interfaces is possible, and through-hole connections are possible. The technology brings design flexibility, allowing developers to create more advanced electronic applications, including those used in the medical field.

Molex has developed an innovative Molded Interconnect Device/Laser Direct Structuring (MID/LDS) technology, called MediSpec, that enables the integration of SlimStack interconnects into 3D headers with integrated traces. Medical device designers are then able to integrate highly complex functions into very compact solutions that are not possible with existing planar 2D technologies.

Using a 3-axis laser to increase flexibility in pattern variation, Laser Direct Structuring (LDS) technology allows micro-striped electronic circuits to be imaged on a wide variety of RoHS compliant molded plastics. In high volume production, it is possible to reduce lines and spaces to 0.10 mm (0.004") and circuit spacing to 0.35mm (0.014"). Numerous other multifunctional features can be added if desired, including laser drilling, switch plates, sensors, and even antennas. As the popularity of MID/LDS technology continues to grow, its capabilities continue to grow as an approach to miniaturization and convergence in the medical industry. Molex maintains a full range of MID reliability testing facilities and support services to ensure product quality and reliability.

Molex Circular MT Expanded Beam Interconnect Solutions provide high density fiber optic interconnects with minimal cleaning while delivering repeatable optical performance over thousands of mating cycles. This expanded beam MT interconnect product includes high density, MPO front panel interfaces such as MPO, array connectors and circular MT connectors, as well as backplanes including High Density Blind Mate MT (HBMT) and Blind Mate MTP (BMTP) Connector. This fiber optic interconnect product won the 2010 Chicago Innovation Award in 2010.

In terms of optical fiber interconnection products, based on Vertical-Cavity Surface-EmitTIng Laser (VCSEL), optical transceiver companies are bringing 25Gbps per channel transceivers to the market. For example, silicon optoelectronics from Luxtera, which combines transistor electronics and photonics on the same chip, allows end users to easily achieve modulation rates higher than 25Gbps at a reasonable cost. Traditionally, copper communication has distance limitations. Luxtera's products, by contrast, enable fiber-optic interconnects, from intermediate circuit boards in large systems, to a range of more than 2 kilometers.