Integrated power stage
Above 1GHz processor, operation requires fast, intelligent power system. The ISL6580 integrated power stage is a high-side FET/driver combination that provides high current per converter phase capability at high switching frequencies. The chip integrates the intelligence, ISL6590 digital controller that provides fast transient response and digital communication. The ISL6580 integrates the main power stage fast power output components, effective heat dissipation design and increased noise immunity. It integrates an integrated P-channel high-side MOSFET, a high-side MOSFET driver and an external synchronously rectified driver for the low-side MOSFET. The ISL6580 also provides a window comparator to provide fast transient response as well as on-board voltage and current A/D converters, intelligent digital communication and control of the ISL6590 controller. In addition, through the communication bus, configuration is available through the ISL6590 and fault monitoring. See the ISL6590 datasheet for details.

Features • Optimized for Intel VR10 applications • When VIN = 12V • Phase 250kHz switching frequency up to 1MHz
• Phase current capability up to 25A
• High-side p-channel MOSFET
• Low-side MOSFET driver • Accurate, non-destructive, current sensing • Programmable MOSFET non-overlapping timing (via ISL6590 digital controller)
• Active Transient Response (ATR) for minimum voltage sag/shoot during large load current transients.
• For system monitoring and serial control interface configuration (ISL6590 controller)
- Input undervoltage protection
- Output under/over voltage protection
- Peak current limit
- Thermal shutdown
- Total reflection limited • provides the best power solution when combined with the ISL6590 digital controller
- Output voltage 0.3VDC to 1.85VDC adjustment range
- VRM-9 and VRM-10 VID codes • Digital interface, high noise immunity and point load placement • On-board analog-to-digital converter
- 10 Msamples/sec voltage A/D conversion
- 1 Msamples/sec current A/D conversion

Related Literature • ISL6590 Data Sheet • Technical Summary TB363 "Guidelines for Handling and Handling Moisture Sensitive Surface Mount Devices (SMDS Based)"
• Technical Bulletin TB379 "Thermal Characterization of Semiconductor Packaging Equipment"
• Technical Bulletin TB389 "Printed Circuit Board Land Pattern Design and Surface Mount QFN Packaging Guidelines (MLFP) Package"