BD8676KN - Silicon Monolithic Integrated Circuit: DC/DC Converter IC for Camera Module of Car Navigation System ◎Features:
· +3.3 V output synchronous buck buck DC/DC converter · 1.2 V output synchronous buck DC/DC converter · 15 V output step-up DC/DC converter and LDO regulator · 5.5 V output voltage controlled Charge Pump (Negative Voltage)
·Soft-start function ·Reset function ·Open/short-circuit protection function in terminal RT construction ·Soft-start function ·Reset function ·The frequency can be set by external resistor ·Protection built-in sequencer control

◎Precautions for use

1. Absolute Maximum Ratings Note that brushed over enough quality control is likely to undermine the Absolute Maximum Ratings (VCC_IN, DCIN) and operating temperature of the range (TOPR) as it is impressed when Modes beyond short-term breakings or openings etc. cannot be specified, and check this IC to give physical safety measures, such as fuses, when a special mode is assumed to exceed absolute maximum ratings.
2. Reverse connected power connector Connect the power connector in reverse and the IC may destroy it. Give measures such as putting the diodes between the power supply terminals to reverse contact damage to protect the outside of the power supply and the IC.
3. Please take measures for the power supply line, such as placing the bypass capacitor in the power supply grounding route closest to the IC pin to cause it to revive the back EMF of the coil and its current to return. Please confirm the characteristics of electrolytic capacitors, the ability at low temperature, omission, etc. have never occurred, and decide.
4. The state of any operation of the grand potential must be the lowest potential potential regarding the terminal grounding potential. Also, confirm that any terminals are actually at voltage GND or less, including transients. [Negative power supply terminal CR (22pin) MV66 (23pin) MV5 (24pin) are excluded. ]
5. Thermal design Think about the allowable losses in the actual use state (PD), and do thermal design with sufficient margin.
6. Miss installation between short and terminal pay enough attention to the direction and miss registration of the IC when you install the board in the setting. The IC can destroy it, and reverse the connection when the power connector is installed incorrectly. In addition, there is the fear of destruction, when a foreign object enters between the terminals, the terminal, the power supply, and majestic, it is a short circuit. in strong electromagnetic fields
7. Operation in the use of strong electromagnetic fields requires attention to the possibility of a malfunction.
8. When the output ground capacitor current is charged, when VCC is 0V, the capacitor or ground and short circuit, a large capacitor is connected between GND output and some factors flow into the output, it is likely to destroy it. Capacitance between GND outputs is 0.1pF or less.
9. Set up board inspection When you connect low impedance capacitors with pins, it may be that every process suffers stress IC and discharges electricity during set up board inspection. In addition, after the separation is connected after the power is turned on, there is no failure in the separation to the G check process, check, and turn off the power. n In addition, the assembly process of the earth that has been given anti-static measures is not careful enough when transporting and you keep it.
10. Each input terminal of this IC is a monolithic integrated circuit, which has a P+ isolation and a P substrate to isolate the elements from each other.
Each element in the P and N layers forms a PN junction, creating various parasitic elements.
For example, the resistor potential difference, when operating below the resistor diagram as shown, the transistor is connected with the terminal and the playground ground (GND) > (terminal B) PN joint operates as a parasitic diode on the playground (GND) > (terminal) transistor ( NPN). In addition, the parasitics of NPN transistors are related to the above-mentioned parasitic diode elements and the residential areas of transistors and other N-layers (NPN). An integrated circuit consists of parasitic elements that are inevitably formed because of the underlying relationship.
A parasitic element can operate, interfere with the operation of the circuit, cause it to malfunction, and therefore, cause damage to it. Therefore, without doing this, the voltage of the parasitic components is lower than that of the playground operating usage (GND, P substrate) impressing the input terminals enough. Also, the voltage input terminals are not impressed when you are not impressed with the supply voltage to the IC. Give each input I terminal voltage lower than the supply voltage, or at the guaranteed value of the electrical characteristics, when you are equally impressed with the supply voltage.
11.Earth wiring mode If there is a small signal GND and a large current grounding, the pattern will be scattered. In addition, the pattern wiring impedance and the voltage change of the large current do not change the voltage of the small signal GND, and the ground terminal of each IC must be connected at one point to set the circuit board. As for the GND external parts, it is similar to the above.
12.Thermal shutdown thermal shutdown operation when the DC/DC converter controller of all channels is turned off. When thermal shutdown is released, all channels of the DC/DC converter controller become a shutdown operation begins.