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2022-10-18 14:20:30
Development Trend and Analysis of TWS Headphone Chip Power Management Technology
An electronic enthusiast network editor Mo Tingting brought the theme of "wearable device industry development and market trend analysis", and analyzed the main chip, sensor, display screen, and operating system from four parts. Siyuan Semiconductor: Development trend and analysis of TWS headset power management technology. At the IoT Wearable Device Forum, Huang Lin, Marketing Director of Siyuan Semiconductor, shared the theme of "Development and Trend of TWS Headphone Power Management Technology".
From 445 million units in 2020 to 2016-2020, the total global shipment of smart wearable devices is 102 million units. It is expected that the compound annual growth rate from 2020 to 2025 will reach 25%, reaching 1.358 billion in 2025. department. The growth of shipments is inseparable from the diversification of product forms, and the products are accepted by consumers. From the original smart watches, smart bracelets, wearable headphones and other products, it is derived from smart rings, smart clothes, smart glasses, and even the universe and so on. An electronic enthusiast network editor Mo Tingting brought the theme of "wearable device industry development and market trend analysis", and analyzed the main chip, sensor, display screen, and operating system from four parts.
In terms of the main film, different chip solutions, BAS70SV has characteristics in the process, performance, integration, product positioning, etc., and can meet the smart watch products of different price points, different uses, and different network requirements. Stimulated by consumer market demand, mainstream chips will continue to grow in the future. The growth momentum mainly comes from three aspects: optimization of user base, product upgrade, and acceleration of medical-grade process. Facing the increasingly refined market demand, new requirements are put forward for the application requirements of the main control chip, which are mainly reflected in the aspects of low power consumption, integration, and multiple external interfaces.
As far as sensors are concerned, in the field of wearable devices, adult watches pay more attention to the use experience, such as battery life, scene integration, health monitoring, and children's watches, in addition to children's learning and social functions, due to the needs of parents, there will also be video and voice. Call, location and other functions. As far as the current development trend is concerned, both adult watches and children's watches have the trend of sports and health monitoring, among which the medical-grade process of adult watches is more obvious.
In order to achieve medical-grade development of wearable devices, cooperation in many aspects such as software and hardware manufacturers will be required in the future. At present, there are still pain points in development, mainly manifested in the difficulty of medical-grade certification, the large investment time, the need to improve the supply chain, the high technical requirements, and the difficulty in commercial implementation.
In the AMOLED industry, flexible AMOLED panels are gradually replacing liquid crystal panels and are being adopted by smart watch equipment manufacturers. The high screen ratio brought by AMOLED has also become the focus of attention of various manufacturers. The development trend of smart meter display is expounded from four aspects: first, miniaturization of display IC; second, new technologies such as integrated algorithms and millimeter-wave radar; third, panel upgrade and screen ratio improvement; fourth, high refresh rate and battery life .
According to Counterpoint Research, Apple WatchOS has a 21.8 percent market share among iPhone users. WearOS (WearOS+Fitbit+Tizen) has risen from 15.7% to 23.7%, becoming the second largest company after Apple WatchOS. But in China, with the rise of Xiaomi, Honor and other brands in the field of smart wear, it has also brought development space for the corresponding operating system. In addition, WearOS is driven by dual platforms. With the merger of Tizen.Fitbit and WearOS, the market position of WearOS will be greatly improved and become a strong competitor of Apple WatchOS.
In 2020, the semiconductor industry is also facing component shortages as it is less affected by chip shortages compared to consumer electronics markets such as smartphones and PCs. After research, it is found that in the electronic friend network, the main film and the sensor are the components with the most obvious impact of this shortage. Although the general environment is "out of stock", shipments of wearable device-related products will continue to grow and drive performance growth without reducing market demand.
At the end of her speech, Mo Tingting talked about the development trend of the wearable device industry in the future: First, the main chip, screen IC, display screen, operating system and other software and hardware will pay more and more attention to low-power design, and the pain point of mileage will gradually Second, the development of sensor technology will promote the improvement of the medical level of the wearable device industry, the third is the formation of a commercial closed loop; the third is the diversification of touch screen forms, which will bring new screens, millimeter-wave radar, laser modules, etc. Increasing demand; Fourth, the domestic mainstream operating system manufacturers will gradually rise in the future, and will present a three-legged, or colorful, colorful consumer market pattern; Fifth, in the consumer market with strong demand, domestic brands will gradually provoke the lead, and in the future, there will be opportunities to dominate Global Wearable Devices Market.
Fu Ruikun: A new wearable Bluetooth chip experience.
Fu Ruikun is an integrated circuit design company focusing on RF IC chip design, research, development and product sales. Fu Ruikun from 2014 -ic/" title="2014 model">2014-ic/" title="2014 model">2014-ic/" title="2014 model">2014-ic/" title="2014 model ">2014-ic/" title="2014 model">2014-ic/" title="2014 model">2014-ic/" title="2014 model">2014-ic/" title="2014 model"> 2014-ic/" title="2014 model">2014-ic/" title="2014 model">2014-ic/" title="2014 model">2014-ic/" title="2014 model">2014- ic/" title="2014 model">2014-ic/" title="2014 model">2014-ic/" title="2014 model">2014-ic/" title="2014 model">2014-ic/ " title="2014 model">2014-ic/" title="2014 model">2014-ic/" title="2014 model">Since its establishment in 2014, it has launched a variety of Bluetooth chips, and in 2016 realized the FR301x audio Bluetooth chip Mass production and annual sales revenue of 50 million. In 2018, the ultra-low power Bluetooth BLESOC chip FR801X.FR801XH was launched in 2019. The 2020 FR508X series dual-mode Bluetooth chips, the FR508X series chips for wearable devices Mass production has already started.
Niu Zhao, Vice President of Fu Ruikun.
Niu Zhao, vice president of Fu Ruikun, said in the "IoT Wearable Device Design Forum" that in addition to smart wear, Fu Ruikun's products are also aimed at health care, home appliance applications, industrial meter reading and other fields. In the field of wearable devices, Fu Ruikun's products have covered smart watches, smart glasses and other products. At the discussion meeting, Niu Zhao brought a smart watch. The development trend of smart bracelets is analyzed, firstly, non-smart watches/bands, secondly, the gradual use of Bluetooth audio as a standard configuration; secondly, continuous blood oxygen detection and continuous heart rate detection will gradually become the first choice; thirdly, non-smart The watch will also support users to add lightweight, high-frequency APP software.
On the whole, the Roadmap of Fu Ruikun Microelectronics has three production lines in general. One is the Bluetooth + WiFi two-in-one module product FR601x, which is mainly for wearable applications and is expected to be launched in 2023. The second is BLE products, and its three generations of products include FR801x.FR801xH.FR800x.
According to reports, Fu Ruikun's FR801X series products are the first generation products in the field of wearable devices. The performance of the second generation FR5082/6 processor has been significantly improved, adding 156MDSP and a larger RAM cache; using KSPI The bus also supports the drive color display of 104M.DTR access mode, adding SDIO port and USB interface externally, and upgrading appropriately to improve the display effect and prolong the life.
Fu Ruikun's 2.5th generation wearable BluetoothSolutionSocietySocietySocietySocietySocietySociety.QSPI*2(DMA) has entered the sample stage.
On this forum, Fu Ruikun also revealed the technical route of future products. By the second half of 2022, FR802x will have an updated multi-core BLE product FR802x. In addition, the third-generation Bluetooth SOC chip FR518x will also be launched in 2022. The FR518x series will use the CrotexM33192MHz multi-core architecture, and the power consumption will be lower, and the dual-mode Bluetooth standby current is half that of the previous FR508x, and the built-in SensorHub unit can reduce the power consumption of the sensor.
Siyuan Semiconductor: Development Trend and Analysis of TWS Headphone Power Management Technology
At the IoT Wearable Device Forum, Huang Lin, Marketing Director of Siyuan Semiconductor, shared the theme of "Development and Trend of TWS Headphone Power Management Technology". Siyuan Semiconductor is a company focusing on battery application and power management system chip design. At present, it mainly provides battery management system chip solutions for consumer electronics, industrial, automotive electronics and other industries.
At the meeting, Huang Lin, Marketing Director of Siyuan Semiconductor, said that with the maturity of TWS earphone technology, the requirements for power management of TWS earphones are becoming more and more clear, and the standby loss is reduced. The energy conversion efficiency of TWS earphones is improved, and the power management of TWS earphones The development direction is how to solve the problem of device interconnection.
Previously, Siyuan Semiconductor designed applications for TWS earphones, and launched TWS charge and discharge power management chips such as SY8812.SY8815 on the charging bin and power management chip. The high efficiency and intelligence of SY8812 have been recognized by the majority of users, with a wide range of applications and a large shipment volume. It can realize the key, power-on, and shutdown management of the single-chip microcomputer on the charging compartment, and provide protection for the discharge of the left ear and the right ear two independent outputs; optimize the design details of different power management of the bluetooth main control platform to improve the power management of the bluetooth main control platform detail.
As far as the TWS power management chip is concerned, Siyuan Semiconductor is constantly optimizing to meet the optimal solution in the field of TWS power management, and constantly update products. So far, Siyuan Semiconductor's power management solutions in the TWS field have achieved front-end charging bins, wireless charging reception, charging and discharging management and applications, which have higher requirements for power management chips, and continue to optimize solution details.
High performance, low cost and low cost are the main directions of Siyuan semiconductor product design. On this basis, Siyuan Semiconductor launched the SY8815 charging compartment power management chip SY8815 this year. Based on SY8801, it optimizes power consumption, conversion efficiency, and doubles the performance, making the product more satisfying to customers.
Qingwei Smart: High-efficiency reconfigurable chips bring a better experience to TWS headset users.
Zhao Junwei, director of Qingwei intelligent voice products, introduced the theme of "energy-efficient reconfigurable chips bring better experience to TWS headset users" in the sub-forum. "Qingwei Intelligence" is a company committed to becoming an international leading reconfigurable intelligent chip enterprise. Its core technology is a reconfigurable computing structure system, providing chip products and solutions for cloud computing.
In 2006, "Qingwei Intelligence" established a reconfigurable laboratory, conducted a lot of research on new structures, and after decades of accumulation, successfully passed the verification of reconfigurable chips. At present, the next products are image chips, voice chips, etc., which will reach 3 million within three years.
In the field of computer chips, most of the performance improvement comes from our Moore's Law, and in recent years, Moore's Law has also gradually slowed down. As the development speed of semiconductor process is getting slower and slower, it has reached the limit position, resulting in slower and slower speed of chip performance improvement. In order to improve the performance of the chip, we need to find a new architecture. This structure has both a CPU and an ASIC and a CPU, which is critical to improving the performance of the chip.
The traditional computing structure adopts an instruction-driven time-domain computing method. During the execution of the instruction, data processing and memory access are required frequently, and the high-frequency operation of the memory will consume too much of the chip. In fact, in traditional computing chips, nearly 80% of the system resources are used to store data or prepare for operations, and the calculation amount is only 20%, and the performance of the chip is not fully reflected. On this basis, using the reconfigurable computing structure, Qingwei Intelligent can make full use of system resources and achieve high efficiency.
In terms of voice signal, the reconfigurable transistor chip has 2-10 times the advantage of the traditional structure chip, and the high-efficiency signal processing efficiency reaches 6.13TOPS/W. At present, Qingwei Intelligent has released a reconfigurable computing engine voice chip integrating TX201 and TX231. According to Zhao Junwei, the audio sampling rate of these two chips reaches 768K, with active noise reduction and call noise reduction functions, which can achieve high-quality audio and are very suitable for TWS headsets, smart bracelets, headphones, Bluetooth speakers and other application scenarios.