FCCSP, EWLB, FCLGA/QFN are in the sensor field; FCCSP/BGA, WLCSP, SIP technology and SIP, FCBGA/QFN/LGA technology are used in in-vehicle entertainment. Compared with 25D through-silicon via (TSV) packaging technology, the solution offers higher performance, higher reliability and lower cost.

In the past, the power, material and appearance of the car were often the main direction of car development and the most important factor for car manufacturers and users. Today, with the improvement of the degree of automotive electronics and the arrival of the wave of automotive intelligence and networking, the number of automotive semiconductors has increased dramatically. It is expected that by 2025 , the cost of automotive electronics will account for about half of the cost of a complete vehicle. ADBS-A320 semiconductor chip has become one of the important forces driving innovation in the automotive industry.

At the same time, user experience has also become the focus of attention. For example, as the most important carrier of user interaction, the evolution of car screens has never stopped. Traditional instrument panels, central control screens, and car entertainment system terminals will face upgrading and integration. There are more and more car screens, full LCD instruments, central control Displays, HUDs, windows, interior and exterior mirrors and other components will bring a smarter and safer interactive experience.

With the application of technologies such as smart cockpit, autonomous driving, and 5G in automobiles, the challenges of automotive chip performance have also increased. Such as high temperature working environment, thermal shock, long working time, generation and reliability of new failure mechanisms will become problems that need to be faced. In this regard, advanced chip packaging technology has become an effective way to solve these problems. Packaging is not only the final step in chip manufacturing, but also a guarantee that automotive chips will work properly in a rigorous environment.

The chip manufacturing technology is undergoing fundamental changes, that is, it has gradually evolved from the previous sealing and installation to advanced sealing measurement based on dense and interconnection, which has become an indispensable technical support for promoting the sustainable and rapid development of the integrated circuit industry.

With the development of ADAS (Advanced Assisted Driving System), new energy vehicles and in-vehicle entertainment technology, Changdian Technology has been committed to promoting the application and innovation of advanced packaging methods, aiming at the reliability, efficiency and cost of automotive chips in the new technology environment. , heat dissipation and a series of problems. For example, FCCSP, EWLB, FCLGA/QFN are used in the sensor field; FCCSP, FOWLP, bumping, and AIP technologies are used in unmanned driving; FCCSP/BGA, WLCSP, SIP technologies and SIP, FCBGA/QFN/LGA technologies are used in in-vehicle entertainment.

In addition, in order to meet the needs of technology and market development, Changdian Technology also launched XDFOI multi-dimensional advanced packaging technology. The technology is a high-density, high-density heterogeneous integration solution for Chiplets. Compared to 2.5D through-silicon via (TSV) packaging technology, the solution offers higher performance, higher reliability and lower cost. The solution realizes multi-layer wiring layers with line width or line spacing up to 2um. In addition, the use of extremely narrow pitch bump interconnect technology enables a large package size to integrate multi-chip, high-bandwidth memory and passive devices.

By integrating different functional devices in the system packaging, XDFOI's full range of solutions greatly reduces the system cost, reduces the packaging size, and has a wide range of application scenarios, mainly focusing on FPGA, CPU, GPU, AI, 5G network chips, etc. Applications that require high computing power.

In the field of automotive electronics, Changdian Technology has planned various types of packaging technology evolution roadmaps according to the needs of different markets, and formed differentiated solutions. In the future, JCET will further form effective interactions with chip companies to help the auto industry flourish.

JCET Group is the world's leading integrated circuit manufacturing and technical service provider, providing integrated circuit system integrated packaging design, technology development, product certification, in-wafer testing, wafer-in-channel packaging and testing, system level One-stop service for all-round chip product manufacturing such as packaging testing and chip product testing. Products and technologies cover mainstream integrated circuit applications such as network communications, mobile terminals, high-performance computing, automotive electronics, big data storage, artificial intelligence and the Internet of Things, and industrial intelligent manufacturing.