Features

multiple gamma buffers

-6 channel ( EL5129 )

-10 channel (EL5329)

Single VCOM amplifier

Low power current

-3.5ma (EL5129)

-5.5ma (EL5329)

about higher speed or higher output power, please refer to the EL5X24 series

provide lead -free (compliance with ROHS standard)

Application

TFT-LCD display

LCD TV

Industrial flat display

Description

Multi -channel buffer

EL5129 and EL5329 integrated multiple gamma buffers and a VCOM buffer for 10 inches and above large panel LCD displays. EL5129 integrates 6 gamma channels, EL5329 integrates 10 gamma channels.

Half of the gamma channels in each device are designed to swing to the upper supply track, and the other half is designed to swing to the lower track. The output capacity of each channel is 10mA continuous output, with a peak of 120mA. Gamma buffer has 10MHz 3DB bandwidth specifications and 9V/μS conversion rate.

Designed a swinging amplifier from the orbit. The output current capacity of VCOM in EL5129 and EL5329 is 30mA continuous, the peak value is 150mA, and the conversion rate is 10V/μs.

Order information

Note: Intersil lead -free product uses special lead -free materials; molded compounds/mold connection materials and 100%matte tin tin The board terminal is compatible with the ROHS standard, and is compatible with SNPB and lead -free welding operations. The MSL of Intersil's lead-free products is classified as a lead-free peak return welding temperature, which meets or exceeds the lead-free requirements of IPC/JEDEC J STD-020.

Figure

Typical performance curve

Operation and application information description

Product description

EL5129 and EL5329 are made of high -pressure CMOS process. They have rail -to -orbit input and output capabilities, and they haveIt has very low power consumption. When the load of 10K and 12PF is driven, the -3DB bandwidth of the buffer is 10MHz, and the conversion rate of 9V/μs is displayed. The -3DB bandwidth of the VCOM amplifier is 12MHz, showing the conversion rate of 10V/μs.

Input, output and power supply voltage range

The rated power supply voltage of EL5129 and EL5329 is 5V to 15V, or the split power supply, with a total voltage range of 5V to 15V. For power supply from 4.5V to 16.5V, it can ensure normal work.

El5129 and EL5329 input co -mode voltage range is within 500MV range outside the power rail. The output amplitude of the buffer and VCOM amplifier usually extends to the 100MV range of the positive negative power rail, and the load current is 5mA. Reducing the load current will make the output voltage closer to each power rail.

The output phase reversal

As long as the input voltage is limited between VS-0.5V and vs ++ 0.5V, phase reversal will not occur in EL5129 and EL5329. Although the output of the device does not change the phase, it should be avoided to input overvoltage. If the input voltage exceeds 0.6V of the power supply voltage or more, the static electricity protection diode placed in the device input stage starts to start, and overvoltage may occur.

Output driving capacity

EL5129 and EL5329 have no internal short circuit protection circuits. If the output is short -circuited to the positive or negative electrode power supply, the buffer limits the short -circuit current to ± 120mA, and the VCOM amplifier restricts the short -circuit current to ± 170mA. If the output is short -term, the power consumption is easy to increase, which will cause components to damage. If the continuous current of the buffer does not exceed ± 15mA, the output continuous current of the VCOM amplifier does not exceed ± 100mA, it can maintain maximum reliability. These restrictions are set up by the design of internal metals.

Unused buffer

It is recommended to connect the input of the unused buffer to the ground.

Power loss

Due to the high output drive capabilities of EL5129 and EL5329, the absolute maximum temperature may exceed 125 ° C under certain load current conditions. Therefore, it is important to calculate the highest knot temperature of the application to determine whether the load conditions need to be modified to keep the buffer in a safe operation area.

The maximum power consumption allowed in a component is determined according to the following conditions:

where:

tjmax the highest knot Warm

tamax the highest ambient temperature

θja the thermal resistance of the package

pdmax sealedThe maximum power consumption in the installation

The actual maximum power consumption of the integrated circuit is the total static power supply current multiply at the total power supply voltage, plus the power generated by the load in IC, or:

]

During procurement, and:

Sinking now.

Among them:

i 1 is the total number of buffers

vs buffer and VCOM total power supply voltage

[123

] ISMAX Total Static current

Vouti Maximum output voltage of the application

vout vcom's maximum output voltage

ILOADI The load current of the buffer

ILA VCOM's load current

If we set the two PDMAX equations to equal Avoid overheating devices. The packaging power consumption curve provides a convenient way to check whether the device will be overheated. Based on the type and environmental temperature, the maximum security consumption can be found in graphics. By using the previous formula, it is easy to see whether the PDMAX exceeds the power reduction curve of the device.

Power bypass and printing circuit board layout

Like any high -frequency device, good printing circuit board layout is a necessary condition for the best performance. It is strongly recommended to adopt ground layer structure. The length of the wire should be as short as possible, and the power insertion must be bypassed to reduce the risk of oscillation. For normal single power operations, in the case of VS-pin ground, a 0.1 μF ceramic capacitor should be placed from VS+pins to the ground. Then connect a 4.7μF 4 capacitor from VS+pins to the ground. A 4.7μF capacitor can be used for multiple devices. If you want to use a split power supply, the same capacitor should be placed on each power supply foot of the ground.

Important instructions: Metal planes used for equipment heat dissipation are connected to the negative power potential (VS-) electrical connection. If VS-ground, the hot pads can be ground. Otherwise, the hot pad must be isolated from any other power.

tssop packaging shape chart

htssop package outer shape diagram