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2022-09-23 17:35:14
SN74LVC1G07DCKR
parameter name
parameter value
Whether lead-free, lead-free or lead-free
Lifecycle Active
Objectid 1358478120
Parts Packaging Code SOIC
Packing Instructions TSSOP,
stitch number 5
Reach Compliance Code unknown
Risk level 5.82
SeriesLVC/LCX/Z
JESD-30 Code R-PDSO-G5
JESD-609 code e1
length 2 mm
Logic IC Type BUFFER
Moisture Sensitivity Level 1
Number of functions 1
Enter the number of times 1
Number of terminals 5
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Output characteristics OPEN-DRAIN
Package body material PLASTIC/EPOXY
Package Code TSSOP
Package shape RECTANGULAR
Package SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260
Propagation Delay (tpd) 8.3 ns
Maximum seat height 1.1 mm
Maximum supply voltage (Vsup) 5.5 V
Minimum supply voltage (Vsup) 1.65 V
Nominal supply voltage (Vsup) 3.3 V
Surface MountYES
Technology CMOS
Temperature class INDUSTRIAL
Terminal Surface TIN SILVER COPPER
Terminal form GULL WING
Terminal pitch 0.65 mm
Terminal position DUAL
Maximum time NOT SPECIFIED at peak reflow temperature
Width 1.25 mm