Application

LNA receiver protection

commercial and defense radar

Features

Established SkyWorks Restrictions Diodes Tube Craft

High power, mid -range and clean design

Low insertion loss: 0.1db@2.6GHz

#8226; Peak power processing to +74 dbm

ultra -low peak leakage power

Strict control of the base width of the I layer

#8226 The design of the countertop and flat chip

explains

Skyworks CLA series Silicon limited diode providing a passive receiver protection within a wide frequency range of 100 Mixh to 30 Mixh. These devices use mature Skyworks silicon technology to generate high -resistance and strictly controlled basal width PIN PIN polar diode. The limiter circuit using these devices has a strong limit and low loss.

The CLA series consists of 11 independent chip design of the base width and capacitors of 11 different signs, which is used to adapt to the application of multi -level limiters. Class structure, thin base width, low capacitor CLA4601-000 , CLA4602-000, CLA4604-000, CLA4605-000 and CLA4611-000 are suitable for low levels and clean applications. This CLA4603-000, CLA4606-000 to CLA4608-000 and CLA4610-000 are graphic design for high-power and mid-range applications.

CLA4609-000 thick base wide countertop diodes are designed for rough limited amplitude applications.

Typical performance features

(test at 25 ° C, 2.6 GHz, Z0 50Ω).

技术说明

CLA4603-000、CLA4606-000到CLA4608-000和CLA4610-000限幅器二极管以钝化的平面芯片结构构造And provided in the form of basic chips.

In CLA4601-000, CLA4602-000, CLA4604-000, CLA4605-000, and CLA4611-000 series, the capacitance value can be provided with a capacitance value of less than 0.08 PF and a passing table configuration. MESA devices provide low -capacitance, so wider bandwidth, lower loss, faster response is to reduce power. These diodes also have chip forms, representingExtreme limit device performance, other manufacturers are not close.

The highest power CLA4609 diode adopts the table structure.

These SkyWorks applications contain other binding and processing methods:

Wastef cake packaging chip carrier processing/opening program (file#200146)

] (File#200532).Diode chip, bundle stream diode, capacitor: connection method and packaging