Contact: Mr. Zhang

Tel: 13286652281 (same number on WeChat)

Landline: 0755-82577741

QQ: 872328909

Address: Room 412, Building 1, Huakang Building, Huaqiang North, Futian District, Shenzhen (delivery is available around the market)

XC7K325T-2FFG900I ▲▲▲Original spot price advantage▲▲▲

XC7K325T-2FFG900I Original Xilinx Specifications

general description

Xilinx® 7 series FPGAs are composed of 4 FPGA families to meet various system requirements, including low cost, small size,

Cost-sensitive, high-capacity applications require ultra-high-end connection bandwidth, logic capacity, and signal processing capabilities

High-performance applications. 7 series FPGAs include:

?Spartan?-7 series: optimized for low cost, lowest power consumption, and high

I/O performance. Offered in a low cost, very small form factor

Packs a minimal PCB footprint.

?Artix?-7 Series: Optimized for low-power applications requiring serial

transceivers and high DSP and logic throughput. provide the lowest

The total cost of materials is high-throughput and cost-sensitive

application

?Kintex?-7 Series: Best price/performance ratio with 2X optimization

An improvement over the previous generation to create a new career

fpga.

?Virtex?-7 series: optimized for highest system performance and

System performance increased by 2 times. Highest

Stacked Silicon Interconnect (SSI) based capability devices

technology. Based on state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, the 7-series FPGAs implement a new class of FPGAs

2.9 Tb/s I/O bandwidth, 2 million logic unit capacity, 5.3 TMAC/s DSP, unprecedented improvement in system performance, while reducing consumption by 50%_

Provides a fully programmable replacement for ASP and ASIC over the power of previous generation devices. 7 Series FPGA Features Summary

?Advanced high-performance FPGA logic based on true 6-input lookup up table (LUT) technology, configurable as distributed memory.

?36 Kb dual port block RAM built-in FIFO logic on-chip data

buffer.

?High-performance SelectIO? technology supporting DDR3

The interface can reach up to 1866 Mb/s.

?High-speed serial connection with built-in multi-gigabit transceiver

From 600mb/s to max. From 6.6 Gb/s to 28.05 Gb/s

A special low-power mode optimized for chip-to-chip interfaces.

? A user-configurable analog interface (XADC), including dual

12-bit 1MSPS analog-to-digital converter with on-chip thermal sum

supply sensor.

?DSP slice 25 x 18 multiplier, 48-bit accumulator and pre-adder

For high performance filtering, including optimized symmetry

Coefficient filtering.

? Powerful Clock Management Tiles (CMT), combined with phase locking

high for loop (PLL) and mixed-mode clock manager (MMCM) blocks

High precision and low jitter.

• Rapid deployment of embedded processing using MicroBlaze™ processors.

Integrated block PCI Express® (PCIe) up to x8 Gen3

Endpoint and root port design.

? Multiple configuration options, including support for

Commodity memory, 256-bit AES encryption with HMAC/SHA-256

Certified, built-in SEU detection and correction.

?Low cost, wire bond, bare die flip chip, high signal integrity flip chip package provides easy migration between family members

in the same package. All packages available Pb-free and selected

Packaged in Pb option.

?Designed for high performance and minimum power at 28nm,

HKMG, HPL process, 1.0V core voltage process technology

0.9V core voltage option for even lower power.