SN74HCT08PWR_AD1988BXCPZ-07-RL Introduction

Combining EtherCAT, Ethernet and CAN FD: In terms of galvanically isolated architecture, the new microcontrollers feature a fast serial interface with 8 receive channels, enabling chip-to-chip communication at speeds up to 200 Mbps with fewer pins. .

According to TI, creating high profit margins is related to their use of 12-inch fabs to produce analog chips and reduce costs. Take TI as an example, its profits and profit margins have maintained an upward trend over the past 10 years and reached new highs in 2018. In the analog chip market, manufacturers such as TI, ADI, and Maxim all have gross profit margins higher than the industry average. The data shows that TI's analog chips had an operating profit margin of 46.7% in 2018, but the operating profit margin of embedded processors was only 29.6%.

SN74HCT08PWR_AD1988BXCPZ-07-RL

TLV3202AQDGKRQ1

IRS23364DSTRPBF LM2904DGKR Universal op amp MP6901DJ-LF-Z Power IC TPS7A6033QKVURQ1 Other IC TPS7A6050QKVURQ1.

PCM1802DBR STN3NF06L MOS (field effect transistor) TPS73725DCQR ADM1278-1BCPZ Other passive components LM317MDT-TR power IC.

STM32F103CBU6TR SN74HC74N Logic ICs SN74HCT04DR SN74HC373DWR SN74HCT14PWR.

LM385M3X-1.2/NOPB CSD87330Q3D Power IC TLV70233DBVR Power IC SGA-4286Z Industrial Control Components UPG2030TK-E2 Ultra-small tube.

SN74HCT08PWR_AD1988BXCPZ-07-RL

AD213EARS

TPS62823DLCR TPS62823DLCT TPS62821DLCT TPS62821DLCR BQ40Z50RSMR-R2.

TPS563209DDCR TPS563209DDCT TS3USB221RSER LM339APWR MAX3232IPWR.

TPS560430XFDBVR XTR117AIDGKR CSD15380F3T MSP-EXP432P401R TPS2051BDBVR.

TPS2549RTER SMD Diode TPD1E1B04DPYR Power IC ISL29026IROZ-T7 Other ICs LD1117DT50CTR Power IC SN74AHC125DR Logic IC.

SN74HCT08PWR_AD1988BXCPZ-07-RL

The resonator used by the ladder type (SAW also mentioned at the end) includes series and parallel. A series resonator plus a parallel resonator is called a stage, and the entire ladder type filter can be composed of several stages. .

Quartz (quartz), as a common piezoelectric material, exhibits linear response under high voltage and high pressure, but there is no suitable method to make quartz into thin film deposits on Si substrates. A suitable BAW piezoelectric material needs high electromechanical coupling coefficient, low electromechanical loss, high thermal stability, and also conforms to IC process technology.

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