MSP430FR2111IPW16R_AD1934YSTZ Introduction

According to TI, creating high profit margins is related to their use of 12-inch fabs to produce analog chips and reduce costs. Take TI as an example, its profits and profit margins have maintained an upward trend over the past 10 years and reached new highs in 2018. In the analog chip market, manufacturers such as TI, ADI, and Maxim all have gross profit margins higher than the industry average. The data shows that TI's analog chips had an operating profit margin of 46.7% in 2018, but the operating profit margin of embedded processors was only 29.6%.

Integrated circuits can be divided into two categories: digital chips and analog chips. The former processes digital signals, such as common memories, microprocessors, etc.; Known as the bridge connecting the physical world and the digital world.

MSP430FR2111IPW16R_AD1934YSTZ

PCM5101APWR IC

PCM1802DBR STN3NF06L MOS (field effect transistor) TPS73725DCQR ADM1278-1BCPZ Other passive components LM317MDT-TR power IC.

STM32F103CBU6TR SN74HC74N Logic ICs SN74HCT04DR SN74HC373DWR SN74HCT14PWR.

TS3A225ERTER TPS2546RTER TMP112AIDRLT TPS82130SILR.

IRS23364DSTRPBF LM2904DGKR Universal op amp MP6901DJ-LF-Z Power IC TPS7A6033QKVURQ1 Other IC TPS7A6050QKVURQ1.

MSP430FR2111IPW16R_AD1934YSTZ

AD22226S

MC908MR32CFUE Other ICs SGM4546YTDK14G/TR SN74LV595APWR Logic IC PCM5101APWR Audio IC LMK00105SQ/NOPB Power IC.

TPS65131TRGERQ1 TPS73701DCQR TPS2421-2DDAR TPS61022RWUR TPS61041DBVR.

LP5036RJVR LP5912-3.3DRVR LP5912-0.9DRVR RTL8188RE-GR SGA-4286Z.

TPS560430XFDBVR XTR117AIDGKR CSD15380F3T MSP-EXP432P401R TPS2051BDBVR.

MSP430FR2111IPW16R_AD1934YSTZ

In the Airgap type, an auxiliary layer (sacrificial support layer) is deposited before the piezoelectric layer is formed, and then the auxiliary layer is removed to form an air gap under the oscillating structure. ?? Because only the edge part is in contact with the underlying substrate, this structure is relatively fragile when under pressure, and similar to the membrane type, the heat dissipation problem also needs attention.

. TI's new product announcement includes an industry-first crystalless wireless microprocessor (MCU) that integrates a TI BAW resonator in a package. Design engineers can use this MCU to achieve simpler and smaller designs while improving performance and reducing cost. Time-to-market is accelerated as designers eliminate the need to screen, calibrate and assemble external quartz crystals.

relevant information