AD1674BD_AD22100SR Introduction

688367214G changes life, 5G changes society, but this change is not so easy. . This reflects, to a certain extent, the speed at which 5G communications are advancing at the individual user level. According to the China Academy of Information and Communications Technology, domestic 5G mobile phone shipments from January to April 2021 will be 91.267 million units, accounting for 72.7% of the overall market, a year-on-year increase of 38.4%. 2020 is the first year of global 5G commercialization as defined by ITU, and China will be a year earlier.

Systems with a communication interface often require an external application-specific integrated circuit (ASIC) or a dedicated host-controlled microprocessor, but this reduces the flexibility of the design architecture, increases complexity, and takes up space on the circuit board. . The newly introduced C2000 F2838x microcontrollers, however, do not rely on external ASICs, thereby reducing the overall solution size and the amount of material used.

AD1674BD_AD22100SR

AD1870AR

AD1582BRT-REEL7 AD1582BRTZ AD1582BRTZ AD1582BRTZ-REEL7 AD1582CRT-REEL7.

AD1385KD AD1403AN AD1403N AD1403N AD15/112.

AD11/2016-0REEL AD11/2041-0REEL AD11/2041-0REEL AD1100ARZ AD1111A-ADJ.

AD1580BRT-RL7 AD1580BRTZ AD1580BRTZ AD1580BRTZ-R2 AD1580BRTZ-REEL.

AD1674BD_AD22100SR

AD22222B3

AD1582ARTZ-REEL7 AD1582ARTZ-REEL7/AD1582ART AD1582ARTZ-RL7 AD1582BRT AD1582BRT-R2.

AD1032AR AD1032AR AD1032AR AD1032AR AD1062KN.

AD1585BRTZ AD1585BRTZ-R2 AD1585BRTZ-REEL7 AD1585CRTZ AD1589336(AD3703).

AD1584ART-RELL7 AD1584ARTZ AD1584ARTZ AD1584ARTZ-R2 AD1584ARTZ-REEL7.

AD1674BD_AD22100SR

Time-to-market is accelerated as designers eliminate the need to screen, calibrate and assemble external quartz crystals. TI's new product announcement includes an industry-first crystalless wireless microprocessor (MCU) that integrates a TI BAW resonator in a package. . Design engineers can use this MCU to achieve simpler and smaller designs while improving performance and reducing cost.

TI's newest SimpleLink™ multi-standard MCU with ?BAW technology can be integrated into low-power wireless RF devices, such as low-power crystalless Bluetooth and Zigbee? technology, thereby reducing wireless RF failures caused by external crystals.

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