The R4 series fixed input DC/DC converters offer advantages in size, performance, reliability and cost. The R4 series converters utilize miniature Chiplet System-in-Package (SiP) technology, enabling an 80% reduction in size and cost savings for customers.

In order to achieve the miniaturization of power modules, Mornsun developed the R4 generation; both the embedded magnetic process concept in the PCB and the Chiplet SiP technology are considered. After many reliability tests, it was found that in some extreme application environments, there are long-term reliability problems in the PCB embedded magnetic process. The R4 series with Chiplet SiP technology not only supports miniaturization, but also achieves better performance than embedded magnetic process in PCB.

The size (L x W x H) of the R4 series has been reduced by 80% and the layout space (L x W) has been reduced by more than 50%_. The R4 generation fully decouples the constraints between size, form factor, surface mount packaging, high performance and high reliability as it integrates circuit technology, process technology and material technology.

The R4 series is designed for distributed power systems and is suitable for applications such as digital circuits, low-frequency analog circuits, relay drive circuits, and data switch circuits.

characteristic

80% reduction in size_50% reduction in layout space_3.1 mm thickness

Micro-SMD package

Operating temperature range: -40°C to +125°C

Static power consumption: 35 mW

Continuous short circuit protection

Capacitive load: 2400 μF

Isolation Capacitance: 8 pF

I/O isolation test voltage: 3000 VDC

ESD to 8 kV class (contact)

Meets AEC-Q100 requirements

application

Distributed Power System

Digital circuits

low frequency analog circuit

Relay driver circuit

Data switch circuit