AD1583BRTZ-REEL7_AD2019BRZ Introduction

In addition, Renesas has adjusted its factory in Otsu, Shiga Prefecture, Japan, to manufacture optoelectronic devices. Taking Renesas as an example, the company's two recently closed fabs are both 150mm, including a factory in Kochi Prefecture, Japan, which mainly produces analog, logic devices and some old-fashioned micro components. It is reported that Renesas expects to close two more 150mm fabs in 2020 or 2021. From a regional perspective, Japan closed a larger number of fabs.

With the maturity and progress of the process technology and the increase in market demand, more and more companies use advanced processes below 20nm to design and produce ICs and devices, which makes more and more IDMs and foundries eliminate low-efficiency production. fab. .

AD1583BRTZ-REEL7_AD2019BRZ

AD1891JN

AD1580ARTZ-REEL AD1580ARTZ-REEL7 AD1580ARTZ-REEL7 AD1580ARTZ-RL7 AD1580-B.

AD1139JD AD1154AD AD1170 AD1172-2AUJZ AD1173.

AD1380KD AD1380KD AD1380KD/JD AD1382KD AD1382KD AD1385JD.

AD1201BRZ AD1210BRZ AD1251ARZ AD1332BD AD1334BD.

AD1583BRTZ-REEL7_AD2019BRZ

AD2019BRZ

AD1582ART-RL AD1582ART-RL7 AD1582ARTZ AD1582ARTZ AD1582ARTZ-REEL7.

AD1022A1RQ AD1022A1RQ AD1022A2RQ AD1022A2RQ AD1022ARQ.

AD1583BRTZ-RL7 AD1583CRT-REEL7 AD1583CRT-RL7 AD1583CRTZ AD1583CRTZ.

AD1585BRTZ AD1585BRTZ-R2 AD1585BRTZ-REEL7 AD1585CRTZ AD1589336(AD3703).

AD1583BRTZ-REEL7_AD2019BRZ

Time-to-market is accelerated as designers eliminate the need to screen, calibrate and assemble external quartz crystals. TI's new product announcement includes an industry-first crystalless wireless microprocessor (MCU) that integrates a TI BAW resonator in a package. . Design engineers can use this MCU to achieve simpler and smaller designs while improving performance and reducing cost.

Quartz (quartz), as a common piezoelectric material, exhibits linear response under high voltage and high pressure, but there is no suitable method to make quartz into thin film deposits on Si substrates. A suitable BAW piezoelectric material needs high electromechanical coupling coefficient, low electromechanical loss, high thermal stability, and also conforms to IC process technology.

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