Features

1.8 V low RDSON; internal output discharge resistor ( ADP191 ) opens the conversion rate limit (ADP191); low input voltage range: 1.1 V to 3.6636 V; 500 mAh continuous working current; transform can be transformed by controlling logic in the control logic of 1.2V logic; 2 μA (maximum) ground current; ultra -low -off current: lt; 1μA; ultra -small 0.8 mm × 0.8 mm, 4 goals 4 goals, 4 goals , 0.4 mm spacing WLCSP.

Application

Mobile phone; digital camera and audio equipment; portable and battery power supply equipment.

General description

ADP190 /ADP191 is a high -voltage side load switch designed for 1.1V to 3.6V operations. These load switches provide power isolation to extend the service life of power batteries. This device contains a low -conducting resistor P channel MOSFET, supports continuous current with more than 500 mAh, and minimizes power loss. The low 2 μA (maximum value) of the grounding current and ultra -low shutdown current makes ADP190/ADP191 an ideal choice for battery operation portable devices. The built -in level displacement used to enable logic makes ADP190/ADP191 compatible with modern processors and GPIO controllers.

The conversion conversion rate of the ADP191 control switch to reduce the input wave current. ADP191 also includes an internal output discharge resistor to discharge the output capacitance when the ADP191 output is disabled.

In addition to operating performance, ADP190/ADP191 occupies the smallest print circuit board (PCB) space, with an area of less than 0.64 mm and 0.60 mm. It can be used for WLCSP with a spacing of 0.8 mm × 0.8 mm, 4 goals, and 0.4 mm.

Typical application circuit

Sequence diagram

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The stress higher than the absolute maximum rated value may cause permanent damage to the device. This is just a stress rated value; the functional operations of the equipment in the operation chapter of this specification or above or any other conditions do not mean. Long -term exposure to absolute maximum rated conditions may affect the reliability of the device.

Hot Data

The absolute maximum rated value is only applied alone, not a combination application. When exceeding the temperature limit, ADP190/ADP191 may be damaged. Monitoring environmental temperature cannot guarantee that T is within the specified temperature range. In the application of high power consumption and low PCB thermal resistance, the highest ambient temperature may need to be reduced.

In applications with moderate power consumption and low PCB thermal resistance, as long as the knot temperature is within the specified range, the highest ambient temperature can exceed the maximum limit. The knot temperature (T) of the device depends on the ambient temperature (TA), the power consumption of the device (PD), and the pair of pairs of environmental thermal resistance (θJa).

The maximum knot temperature (TJ) is calculated by the ambient temperature (TA) and power consumption (PD):

The pair of pairs of pairs of environmental heat resistance ( θja is based on modeling and calculations using 4 layers. Connection to the environmental thermal resistance depends on the application and circuit board layout. In applications with high maximum power consumption, the design of hot board needs to be closely focused on. The value of θ may be different, depending on PCB materials, layout and environmental conditions. The specified value of θJa is based on a 4 -layer 4 -inch × 3 -inch PCB. For more information on the structure of the circuit board, see JESD51-7 and JESD51-9. For more information, see the AN-617 application description Microsp. Wall -level chip -grade packaging

ψjb is a connecting board thermal characteristic parameter in the connection board in ° C/W. The encapsulated 基JB is based on the modeling and calculation of the four -layer board. JESD51-12 Documents Electronic Packaging Heat Information Report and Use Guide " pointed out that thermal parameters are different from thermal resistance.热 Measure the power flow flowing through multiple heat paths instead of a single path