AD1582ART_AD1984JCPZ Introduction

With the maturity and progress of the process technology and the increase in market demand, more and more companies use advanced processes below 20nm to design and produce ICs and devices, which makes more and more IDMs and foundries eliminate low-efficiency production. fab. .

The BQ25792 is available in a 4mm x 4mm, 29-pin QFN package and is available now from TI and authorized resellers. The BQ25790 is available in a 2.9mm x 3.3mm, 56-pin WCSP package and is available now from TI and its authorized resellers. Complete reels and custom reels are available on TI.com and through other channels, starting in 1,000 pieces.

AD1582ART_AD1984JCPZ

AD1836AS

AD1583ARTZ-REEL7 AD1583ARTZ-REEL7 AD1583ARTZ-RL7 AD1583BRT-REEL7 AD1583BRT-REEL7.

AD1580BRT-RL7 AD1580BRTZ AD1580BRTZ AD1580BRTZ-R2 AD1580BRTZ-REEL.

AD1580BRTZ-REEL7 AD1580BRTZ-REEL7 AD1580BRTZ-REEL7 AD1580BRTZ-REEL7/AD1580BRT AD1582ART.

AD1580ARTZ-REEL AD1580ARTZ-REEL7 AD1580ARTZ-REEL7 AD1580ARTZ-RL7 AD1580-B.

AD1582ART_AD1984JCPZ

AD390JD

AD1584ART-RELL7 AD1584ARTZ AD1584ARTZ AD1584ARTZ-R2 AD1584ARTZ-REEL7.

AD1585ART-REEL7 AD1585ARTZ-R2 AD1585ARTZ-REEL7 AD1585ARTZ-REEL7 AD1585BRTZ.

AD1583BRTZ-RL7 AD1583CRT-REEL7 AD1583CRT-RL7 AD1583CRTZ AD1583CRTZ.

AD1582CRT-REEL7 AD1582CRTZ-REEL7 AD1583ART AD1583ART-REEL7 AD1583ARTZ.

AD1582ART_AD1984JCPZ

Quartz (quartz), as a common piezoelectric material, exhibits linear response under high voltage and high pressure, but there is no suitable method to make quartz into thin film deposits on Si substrates. A suitable BAW piezoelectric material needs high electromechanical coupling coefficient, low electromechanical loss, high thermal stability, and also conforms to IC process technology.

"Making accurate, informed decisions through the use and analysis of large amounts of data is a very important innovation capability," said Ray Upton, vice president of TI's Interconnect Microcontrollers Group. "Wireless networks are at the heart of this data migration, through The ability of connected devices to connect the last mile is a critical part of the data loop."

relevant information