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2022-09-23 17:58:49
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AD1580ART_AD1981BJST Introduction
Texas Instruments (TI) (NASDAQ: TXN) has been making progress for decades. We are a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
688367214G changes life, 5G changes society, but this change is not so easy. . This reflects, to a certain extent, the speed at which 5G communications are advancing at the individual user level. According to the China Academy of Information and Communications Technology, domestic 5G mobile phone shipments from January to April 2021 will be 91.267 million units, accounting for 72.7% of the overall market, a year-on-year increase of 38.4%. 2020 is the first year of global 5G commercialization as defined by ITU, and China will be a year earlier.
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Compared with 4G, 5G has clearly planned three application scenarios at the initial stage: enhancing mobile broadband, its peak rate will be more than 10 times that of 4G network; massive machine communication will realize the whole process from consumption to production, from human to human. Full scene coverage to objects; ultra-reliable and low-latency communication, the communication response speed will be reduced to millisecond level. . However, 5G is not limited to mobile phones. In the era of the Internet of Everything, highways must be built in advance. Therefore, 5G is indisputably the first of new infrastructure.
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Physically, waves are mainly divided into two types, one is electromagnetic wave, which does not require any medium, but propagates through the periodic oscillation of the electric and magnetic fields generated by the initially charged particles. It can also propagate in a vacuum. Radio waves, microwaves, visible light, X-rays, and gamma rays are all electromagnetic waves.
Quartz (quartz), as a common piezoelectric material, exhibits linear response under high voltage and high pressure, but there is no suitable method to make quartz into thin film deposits on Si substrates. A suitable BAW piezoelectric material needs high electromechanical coupling coefficient, low electromechanical loss, high thermal stability, and also conforms to IC process technology.
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