PCM1793DB_TPS7433DR Introduction

688367214G changes life, 5G changes society, but this change is not so easy. According to the China Academy of Information and Communications Technology, domestic 5G mobile phone shipments from January to April 2021 will be 91.267 million units, accounting for 72.7% of the overall market, a year-on-year increase of 38.4%. . 2020 is the first year of global 5G commercialization as defined by ITU, and China will be a year earlier. This reflects, to a certain extent, the speed at which 5G communications are advancing at the individual user level.

. The details are shown in the figure below. According to IC Insights statistics, in the past 10 years (2009-2018), all 11-ball semiconductor manufacturers closed or rebuilt a total of 97 fabs. Among them, 42 150mm fabs and 24 200mm fabs were closed, while the number of closed 300mm fabs accounted for only 10% of the total.

PCM1793DB_TPS7433DR

74CBTLV16211CGRDR

The 9200 SSD provides high capacity, fast speed, and low latency for demanding functions such as application and database acceleration, online transaction processing (OLTP), high-frequency trading, and high-performance computing, and is one of the first NVMe SSDs on the market with capacities over 10 TB. one. .

Our nearly 80,000+ products help approximately 100,000 customers efficiently manage power, accurately sense and transmit data, and provide core 1-core control or processing in their designs into industrial, automotive, personal electronics products, communications equipment, and enterprise systems.

Universal charging enables portable devices, such as blood pressure monitors and low-power continuous positive airway pressure (CPAP) machines, to be charged via a car adapter or USB-PD adapter, bringing greater flexibility and convenience to portable devices . For more information, read the article "Universal fast charging is the future of battery charging applications." On-the-go (OTG) charging is supported through forward and reverse bidirectional operation of the charging IC.

The charger's integrated dual input selector supports multiple power sources including wireless, USB, barrel jack and solar charging, while providing fast charging - up to 97% efficiency at 30 W. . The BQ25790 and BQ25792 offer the flexibility of one- to four-cell charging, are compatible with both USB Type-C and USB PD input standards, and charge currents up to 5 A over the entire input voltage range (3.6 V to 24 V).

PCM1793DB_TPS7433DR

TRS3232EIDB

TPS65400RGZR TPS65400RGZT TPS92515QDGQRQ1 TPS92515QDGQTQ1 TPS560430XFDBVT.

71022AE3 71025AE3 7180W 74088820 74088820APSE-QAA 7B30-02-1 7B32-01-1 7B34-03-1 7B34-04-1 7B34-04-1 Other passive components.

TPS54310PWPR TPA3116D2DADR LM3429MHX/NOPB DP83867CRRGZT TPS62172DSGR.

Operators urgently need to significantly reduce site construction costs and operating costs, so higher requirements are placed on chip integration, power consumption and cost. In this regard, according to Wenjing, an outstanding technical expert from Texas Instruments (TI), part of the reason is that due to the high frequency and high performance of 5G MM, the use of Massive MIMO technology requires multi-channel architectures such as 32 channels and 64 channels. The increase in the number of hardware channels directly leads to Cost, power consumption, and volume indicators have risen exponentially. All good things ahead, the road will always be twists and turns. In the industry, the shortcomings of 5G base stations are ridiculed as "three 3s of coverage, cost, and power consumption", that is, 3 times the cost, 3 times the power consumption, and 1/3 coverage. .

PCM1793DB_TPS7433DR

The typical basic structure is shown in the figure (a) above, with the piezoelectric layer sandwiched between the upper and lower metal electrodes, the corresponding mBVD equivalent circuit is shown in the figure (b) above, and the corresponding impedance is shown in the figure (c) above. It can be seen that there are two resonance frequencies, series (fs) and parallel (fp). The working principle is as shown below.

TI's new product announcement includes an industry-first crystalless wireless microprocessor (MCU) that integrates a TI BAW resonator in a package. Time-to-market is accelerated as designers eliminate the need to screen, calibrate and assemble external quartz crystals. . Design engineers can use this MCU to achieve simpler and smaller designs while improving performance and reducing cost.

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