AD1854JRSRL_AD3410A Introduction

Systems with a communication interface often require an external application-specific integrated circuit (ASIC) or a dedicated host-controlled microprocessor, but this reduces the flexibility of the design architecture, increases complexity, and takes up space on the circuit board. The newly introduced C2000 F2838x microcontrollers, however, do not rely on external ASICs, thereby reducing the overall solution size and the amount of material used. .

The TPS62840 joins TI's portfolio of highly integrated low-IQ DC/DC converters, enabling designers to maximize power output in the smallest possible solution size.

AD1854JRSRL_AD3410A

AD1881AJST-REEL

AD1021RQ Memory IC AD1022A1RQ AD1022A1RQ Module AD1022A2RQ AD1022A2RQ Other IC AD1022ARQ AD1022ARQ Module AD10242TZ AD10242TZ Other Passive Components AD1025ARQ.

In addition to these features, the C2000 F2838x microcontrollers offer enhanced real-time control performance and greater flexibility than previous generation C2000 series microcontrollers. For more information on the F2838x family of microcontrollers, .

ACA1205S7PO ACA1205S7PO IC ACA1206R ACA1206RS7P2 ACA2401S7P0 ACA2402S7PO ACA2402S7TR ACA2407ES7P0 ACA2407RS7P9 ACA2407S7PO .

ACA0861BRS7P2 ACA0861C ACA0861CRS7P2 ACA0861DRS7P2 ACA0861R ACA0862BRS7P2 ACA0862DRS7P2 ACA1205 ACA1205R ACA1205R.

AD1854JRSRL_AD3410A

AD22100KT

5962-8777101MCA=OP400AY/883B 5962-8856501CA 5962-8856502CA 5962-8859301MPA=OP200AZ/883 5962-8872101PA 5962-8876403XA 5962-8954401PA 5962-8965702LA 5962-8969701XA 5962-8980101CA 。

LM5176PWPR LM5176PWPT DRV8876PWPR TPS23751PWPR TPS61194PWPR.

TPS54310PWPR TPA3116D2DADR LM3429MHX/NOPB DP83867CRRGZT TPS62172DSGR.

71022AE3 71025AE3 7180W 74088820 74088820APSE-QAA 7B30-02-1 7B32-01-1 7B34-03-1 7B34-04-1 7B34-04-1 Other passive components.

AD1854JRSRL_AD3410A

TI's newest SimpleLink™ multi-standard MCU with ?BAW technology can be integrated into low-power wireless RF devices, such as low-power crystalless Bluetooth and Zigbee? technology, thereby reducing wireless RF failures caused by external crystals.

Quartz (quartz), as a common piezoelectric material, exhibits linear response under high voltage and high pressure, but there is no suitable method to make quartz into thin film deposits on Si substrates. A suitable BAW piezoelectric material needs high electromechanical coupling coefficient, low electromechanical loss, high thermal stability, and also conforms to IC process technology.

relevant information