AD1848KP_AD2S82ALPZ Introduction

As a major automotive semiconductor solution provider in the industry, ADI has entered the automotive electronics market very early. With decades of accumulation in the analog IC field, ADI's series of products have completely covered several core areas in the automotive field.

. With the maturity and progress of the process technology and the increase in market demand, more and more companies use advanced processes below 20nm to design and produce ICs and devices, which makes more and more IDMs and foundries eliminate low-efficiency production. fab.

AD1848KP_AD2S82ALPZ

ACA0861BRS7P2

In addition to these features, the C2000 F2838x microcontrollers offer enhanced real-time control performance and greater flexibility than previous generation C2000 series microcontrollers. For more information on the F2838x family of microcontrollers, .

Hyundai Motor Corporation's RANC system significantly reduces noise in the vehicle cabin. The system can analyze all kinds of noise in real time and generate anti-phase sound waves. This new technology can deal with a variety of different road noises, such as the resonance between the tire and the wheel, or the roar from the road surface.

A key component required to achieve this is a new connection manager based on the Arm® Cortex®-M4 subsystem, which reduces some of the processing-intensive communications and optimizes connectivity. The F2838x microcontrollers integrate three industrial communication protocols, enabling designers to tailor a microcontroller to the specific needs of each system.

A6334OLG ABA3100 ABA3100R ABA3100RS3 IC ABA3115 ABA3115R ABA3130R ABA3130RS26Q1 ACA0861 Octal ACA0861ARS7P2.

AD1848KP_AD2S82ALPZ

AD22105ARZ-REEL7

TPS630701RNMT TPS630702RNMR TPS54218RTER TPS92692PWPR TPS56C230RJER.

UCC28063DR LM536003QDSXRQ1 UCC2892DR MSP430FR2111IPW16R UCC21520QDWRQ1.

AD0002SSN AD08G4826-C89240 AD08G4826-C89240 IC AD08G5039-C85684 AD08G5039-D00053 AD08G5155 Other passive components AD1021AARQZ AD1021AARQZ module AD1021ARQ AD1021RQ.

TPS560430XFDBVR XTR117AIDGKR CSD15380F3T MSP-EXP432P401R TPS2051BDBVR.

AD1848KP_AD2S82ALPZ

Compared with BAW-SMR, a smaller part of the membrane type is in contact with the underlying substrate, which is not easy to dissipate heat. However, the thin film structure needs to be strong enough to be unaffected by subsequent processes.

In the Airgap type, an auxiliary layer (sacrificial support layer) is deposited before the piezoelectric layer is formed, and then the auxiliary layer is removed to form an air gap under the oscillating structure. ?? Because only the edge part is in contact with the underlying substrate, this structure is relatively fragile when under pressure, and similar to the membrane type, the heat dissipation problem also needs attention.

relevant information