AD1812JS_AD241JR Introduction

As a major automotive semiconductor solution provider in the industry, ADI has entered the automotive electronics market very early. With decades of accumulation in the analog IC field, ADI's series of products have completely covered several core areas in the automotive field.

However, in view of the sluggish semiconductor market in 2019 and the unsatisfactory revenue situation, TI's plan to invest in the construction of a 300mm wafer fab in Richardson is not as smooth as originally expected, and it may be delayed for two years to complete. In April 2019, Texas Instruments released the construction plan for this 300mm fab, with an estimated investment of 3.1 billion mei yuan.

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. In the past year, ADI has been in constant action, and news of cooperation with a well-known car company has been frequently reported. We can also get a glimpse of some new trends in automotive application innovation.

A key component required to achieve this is a new connection manager based on the Arm® Cortex®-M4 subsystem, which reduces some of the processing-intensive communications and optimizes connectivity. The F2838x microcontrollers integrate three industrial communication protocols, enabling designers to tailor a microcontroller to the specific needs of each system.

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With the advancement of science and technology, a technology called Active Noise Cancellation (ANC) has made this "luxury idea" a reality, and has gradually been applied to many fields closely related to human life, such as consumer electronics, car cockpits, and smart home appliances.

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. Compared with traditional road noise reduction system solutions based on analog technology, A2B technology ensures low latency characteristics, allowing Hyundai vehicles to implement this breakthrough RANC technology, which greatly reduces the noise in the vehicle cabin.

AD1812JS_AD241JR

As a common piezoelectric material, quartz exhibits a linear response under high voltage and high pressure, but there is no suitable method to make quartz into a thin film deposit on a Si substrate. Appropriate BAW piezoelectric materials require high electromechanical coupling coefficient, low electromechanical loss, high thermal stability, and conform to IC process technology.

TI's new newer SimpleLink™ multi-standard MCUs with ?BAW technology can be integrated into low-power wireless RF devices, such as low-power crystalless Bluetooth and Zigbee? technology, thereby reducing wireless RF failures caused by external crystals.

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