AD1807JSZ_AD2410WCCSZ-RL Introduction

Combining EtherCAT, Ethernet and CAN FD: In terms of galvanically isolated architecture, the new microcontrollers feature a fast serial interface with 8 receive channels, enabling chip-to-chip communication at speeds up to 200 Mbps with fewer pins. .

. According to IC Insights statistics, in the past 10 years (2009-2018), all 11-ball semiconductor manufacturers closed or rebuilt a total of 97 fabs. The details are shown in the figure below. Among them, 42 150mm fabs and 24 200mm fabs were closed, while the number of closed 300mm fabs accounted for only 10% of the total.

AD1807JSZ_AD2410WCCSZ-RL

AD1865P

7B35-01-1 7B39-01 8320-ARP 85-1273202 8532A 8551401PA 878321414 88M3521ACBZ-R7 99093 A16.

A6334OLG ABA3100 ABA3100R ABA3100RS3 IC ABA3115 ABA3115R ABA3130R ABA3130RS26Q1 ACA0861 Octal ACA0861ARS7P2.

. In the past year, ADI has been in constant action, and there have been frequent news of cooperation with major well-known car companies. We can also glimpse some new trends in automotive application innovation.

1B21AN Other ICs 1B51AN 22050N 22057R 221R950 26TL In-Line Crystal Oscillator 2904H6 IC 2B54A 2B54BB 32F9729 .

AD1807JSZ_AD2410WCCSZ-RL

AD1895AYRS

LM5176PWPR LM5176PWPT DRV8876PWPR TPS23751PWPR TPS61194PWPR.

ACA2407S7PO IC ACA2408S7P2 ACA2604R ACD0900RS3P1 ACD0900RS3P1 IC ACD2204 ACD2206 ACD2206. ACD2206S8P1 ACD2206S8P1 IC.

ACU2109 ACU2109RS3P1 ACU2109S3CTR ACU2109S3CTR IC ACU50572 ACU50750 ACU50750S3CTR ACU50751 ACU50752 ACY22.

TPS54310PWPR TPA3116D2DADR LM3429MHX/NOPB DP83867CRRGZT TPS62172DSGR.

AD1807JSZ_AD2410WCCSZ-RL

Only the ladder type and lattice type are briefly introduced here. The BAW filter can connect multiple resonators according to a certain topology. There are many types of BAW filters, including ladder type filter, lattice type filter, stacked crystal filter and coupled resonator filter.

In the Airgap type, an auxiliary layer (sacrificial support layer) is deposited before the piezoelectric layer is formed, and finally the auxiliary layer is removed to form an air gap under the oscillating structure. ?? Because only the edge part is in contact with the underlying substrate, this structure is relatively fragile when under pressure, and similar to the membrane type, the heat dissipation problem also needs attention.

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