Features

Industrial standard pins

Enable the function of each driver

High current driving capacity ± 4 a

Unique double pole And cmos real drive output

provides large current on MOSFET

Miller threshold

TTL/CMOS compatible input, independent of

Power supply voltage [ 123]

20 NS typical rise and 15 ns typical decline

1.8-nf The number of times under load

Typical 25 ns transmission delay time

Input decrease, input input, input Rising 35ns

4-V to 15-V power supply voltage

dual output can be parallel

Drive current

can be used for thermal enhancement MSOP

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[ 123] PowerPadtm component with 4.7 ° C/wθJC

The rated temperature is -40 ° C to 105 ° C

Switching power supply

DC /DC converter

Electric controller

Line drive

Class switch amplifier

ucc27423

]/4/5 series high -speed dual MOSFET drivers can pass the large peak current to the capacitor load. Provide three standard logic options-dual reversal, dual-non-reverse and one reversal and one non-driver. The thermal enhancement 8 -shot PowerPadtm MSOP component (DGN) greatly reduces the thermal resistance to improve long -term reliability.

Standard SOIC-8 (D) or PDIP-8 also provides (P) parcels. Using a inherent minimum penetration design, these drivers provide a 4-A current in MOSFET switch conversion in the Miller Plateau area. The unique bipolar and parallel MOSFET hybrid output level also allows effective current sources and sinks when low power supply

.

UCC27423/4/5 provides enable (ENBL) function to better control the driver's operation application. ENBA and Enbb did not use standard pins in the industry before PIN PIN. They are pulled to VDD to actively high logic internally, and can keep the state of opening

under standard conditions.

Block Figure

The absolute maximum rated value is higher than the temperature of the free air (unless otherwise explained) -power supply voltage, VDD. -0.3 il to 16 volt output current (outa, outB) DC, IOUT U DC. 0.3 An Ana (0.5 microsecond), iOUT_ pulse. 4.5 An input voltage (INA, INB), vehicle recognition number. -5 V to 6 V or VDD+0.3 (prevailing as the larger) enable voltage (enBa, ENBB) — 0.3 V to 6 V or V. DD+0.3 (prevailing as a larger) power consumption (DGN packaging) 3 W at TA 25 ° C.

(D package) 650 MW.

(P package) 350 MW.

Jacking work temperature TJ. -55 ° C to 150 ° C storage temperature, TSTG. -65 ° C to 150 ° C lead temperature (welding, 10 seconds), 300. The stress other than the stress listed below the absolute maximum rated value " may cause permanent damage to the device. These are only stress levels