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2022-09-15 14:32:14
OPA564 is 1.5A, 24V, 17MHz power operation amplifier
Features
High -output current: 1.5A
Wide power supply range:
- Single power supply:+7v to+24V [ 123]- Double power supply: ± 3.5V to ± 12V
Output width: 20VPP
complete protection: [123 ]
- Hot shutdown- adjustable current limit
diagnostic signs:
- Overcurrent
- Hot shutdown [ 123]
output enable/off control
High speed:
-gain bandwidth product: 17MHz
- full power bandwidth is 10VPP 10VPP is 10VPP is 10VPP. : 1.3MHz
-Conversion rate: 40V/ms
Diode used for temperature monitoring
HSOP-20 power board # 8482; Packaging (bottom and top insulation pad version)
Application
Power line communication
] VCOM Driver
Electric driver
Audio power amplifier
Power output amplifier
[123] Test equipment amplifier
sensor excitation
laser diode driver
general linear power amplifier [123 ]
ExplanationOPA564 is a low -cost, large current transportation amplifier, which is very suitable for driving up to 1.5A without merit. High conversion rate provides a full -power bandwidth and good linearity of 1.3MHz. These single -piece integrated circuits provide high reliability in high -demanded power line communication and motor control applications.
OPA564 works at a single power supply 7V to 24V or dual power supply ± 3.5V to ± 12V. In the operation of a single power supply, the input of the co -mode range is extended to the negative electrode power supply. At the maximum output current, the wide output swing provides 20VPP (iOUT u003d 1.5A) capabilities, nominal 24V power supply.
OPA564 has internal protection to prevent excessive temperature and current overload. It aims to provide an accurate, useThe current limitation of the household selected. Provide two logo outputs; one indicates current limit, and the other represents overheating. It also has a enable/closed pins, which can force low -closing output and effectively disconnect the load.
OPA564 is installed in a heat-enhanced surface installation powerboard #8482; package (HSOP-20), and you can select hot pads at the top or bottom of the package. The operations of both models are within the industrial temperature range, namely -40 ° C to+85 ° C.
OPA564 related products
(1), PowerPad internal connection to the connection V, always needs to welded PowerPad to PCB, even low -power applications. 
Function pin Figure
Typical features
tcase u003d+25 ° C, vs u003d ± 12V, RLOAD u003d 20K #8486 ; By the GND, RSET u003d 7.5kΩ, E/S pins are enabled, unless there is another explanation.
Application information 
Basic configuration 
FIG. 35 shows OPA564 connected as a basic non -conversion amplifier. However, OPA564 can be used for almost any operational amplifier configuration. 
The power terminal should be bypass with low series resistance resistance. The technology of ceramic capacitors and electric containers is introduced in parallel. The power terminal should have low series impedance. 
Note: (1) RSET sets the current limit value from 0.4A to 1.5A.
(2) E/s pin forced low -closing output.
(3) VDig must not exceed (V -)+5.5V; examples of generating signals for VDig, see Figure 56.
Power supply
OPA564 on single road (+7V to+24V) or double (± 3.5V to ± 12V) analog power supply and+3.3V to+5.5V (reference v-quotation The digital power supply has excellent performance. Please note that as long as the total voltage is kept below 24V, the simulation power supply voltage does not require symmetry. For example, the positive power supply can be set to 14V and the negative power supply voltage is -10V. In the range of working voltage, most behaviors remain unchanged. The typical characteristicThe parameters showing a significant change with the working voltage. 
(1) The power order shown in (a) is not allowed. The order of this power will damage the equipment.
Figure 36: Power supply order
adjustable flow limit
OPA564 through its accurate, user -adjustable current limit to provide current protection for load (ISET pin) Essence By controlling the current through the ISET pin, you can set the current limit value ILIM between 0.4A and 1.5A. Setting current limit does not require special power resistors. The output current does not flow through the ISET pin. 
Generally rough restrictions on the output current, a simple resistance in the negative track is sufficient. FIG. 30 shows the error percentage between the transmission function between Iset and iOut and the current limit settings. Figure 31 and Figure 32 show how the error is transformed between IOUT and RSET. The dotted line represents the ideal output current settings. The non -matching of the band gap benchmark, the internal 5kΩ resistor, the current restriction and the output -class mirror, and the changes in the tolerance and temperature coefficient of the RSET resistor that are relatively negative. In addition, the increase in knot temperature will cause the accuracy between the Iset and the iOUT mirror to not match. Figure 53 shows a method that can dynamically change the current limit settings with a simple zero -drift current source. This method simplifies the current limit equation to: 
The current that enters the ISET pin is determined by the NPN current source. Therefore, the error caused by the internal 1.2V band gap benchmark and the 5KΩ resistor's outfitting, thereby improving the overall accuracy of the transmission function. In this case, the main source of errors in Isets is the β of the RSET resistor and the NPN transistor.
Therefore, when the user tries to restrict the output current roughly, it should be noted that the current output of the 56th level 56 passes the current restriction setting through dynamic switching. The output voltage through the feedback loop of OPA564 can better achieve predictable performance.
Set the current limit
The non -connected ISET pin will damage the device. It is not recommended to directly connect Iset to V -because its programming current limit far exceeds the 1.5A capacity of the device and leads to excessive power consumption. The minimum recommended value of RSET is 7.5K #8486;1.9A. The maximum value of RSET is 55K #8486; and it has a minimum current to be programmed to approximately 0.4A. The easiest way to adjust the current limit (ILIM) is to use the resistor or potential between connected to the ISET pin and V -), according to Formula 1.
If ILIM has been defined, it can be solved by re -arranging equation 1 as equation 3: 
RSET and 5K #8486; internal resistors; internal resistors Together the small current volume of the required output current limit is determined.
FIG. 37 shows the simplified schematic diagram of the OPA564 current limit architecture.
Enable/close (E/S) pin
When the E/S pin is compulsory to low, the output of OPA564 is closed. For normal operation (output enable), the E/S pin must be pulled (at least higher than V-) 2V. In order to permanently enable OPA564, E/S pins can be kept disconnected. E/S pins have an internal 100k #8486; upper pull resistor. When the output is closed, the output impedance of the OPA564 is 6GΩ | | 120pf. The relationship between the output off the output voltage and the output current is shown in Figure 42. Although the output is high impedance when closed, there is still a path to enter the input level grounding through the feedback network; see Figure 43. In order to prevent damage to OPA564, ensure that the voltage between the input terminal+in and -IN does not exceed 0.5V, and the current of the input terminal does not exceed 10mA when running the power guide V -and V+. See the input protection part.
Input protection
The input protection on OPA564 uses electrostatic discharge (ESD) protection, back -to -back diode and input resistance (see Figure 43). Due to the limited conversion rate of the amplifier, it exceeds the opening threshold of these diode. If it is under pulse conditions, the current flows through the input protection diode. If the input current is not restricted, the back -to -back diode and input device may be destroyed. The high input current source also causes fine damage to the amplifier. Although the device may still work normally, important parameters, such as input offset voltage, drift, and noise may occur.
When using OPA564 as a unit gain buffer (follower), as a inverter amplifier or in the shutdown mode, the input voltage between the input terminal (+in and -IN) must be limited More than 0.5V. This state must be maintained in the entire common mode range of V+. If the input is located above the power rail, the current to protect the diode through the ESD must be limited to 10mA. During the displacement of the track, the voltage between the input terminals still needs to be limited. If necessary, add an external backbone diode between+in and -IN to maintain the between these connections0.5V requirements.
Output shutdown
Torter pins (E/S) refer to the negative electrode power supply (V-). Therefore, in the single power supply and dual power application, the shutdown operation is slightly different. In the operation of a single power supply, V -usually equals common. Therefore, the downtime signal is the same potential as the OPA564 shutdown pins. In this configuration, the logic foot and OPA564 Enable can be simply connected. When the voltage level is lower than 0.8V, shutdown will occur. OPA564 is enabled at a logical level higher than 2V. In dual power operation, logical pins still refer to logical ground. However, the closing pin of OPA564 continues to refer to V -.
Therefore, in the dual power system, the OPA564 should be turned off, and the voltage level of the logical signal must be shifted in a certain way. One way to change the logic signal voltage level is to use optocouplers, as shown in Figure 38. 
In order to close the output, the E/S pins low, not higher than V -0.8V. This function can be used to save electricity during idle. To restore the output to the enable state, the E/S pins should be pulled to at least V -2.0V. Figure 27 shows typical enable and closed response time. It should be noted that the E/S pin does not affect the internal heat shutdown.
When OPA564 is used for device shutdown applications, pay special attention to input protection. Consider the following two examples.
FIG. 39 shows the amplifier in the follower configuration. The load is connected in the middle of the power V+and V-.
When the device is closed in this case, the load pulls VOUT to the ground. Then there is rarely or without current flowing through the input end of OPA564.
Consider Figure 40 now. Here, the load is connected to V -. When the device is turned off, the current flows through the first 1.6kΩ resistor from the positive input+in, protects the diode by input through an input, and then passes through the second 1.6kΩ resistor, and finally flows to V -through the 100Ω resistor.
This current generates a voltage that is greater than 0.5V at the input terminal, which damages OPA564. If the load is connected to the positive power supply, similar problems will occur.
Pay attention to safety
This configuration will damage the device.
The solution is to place an external protection diode on the OPA564 input end. Figure 41 illustrates this configuration.
Note: This configuration is protected input during shutdown.
Ensure that the compatibility of the microcontroller
Not all micro -controllers output the same logical state after power -on or reset. E.gThe 8051 micro -controller outputs high levels, while other models use a logic low level after reset. In the configuration of FIG. 38 (a), the cathode side of the optoelectronics diode in the optical diode in the optical coupling is turned off. High -logic electricity is activated by OPA564, and low -logic electric flats make OPA564 close. In the configuration of FIG. 38 (b), the logic signal is applied to the anode side, the high level is closed, and the OPA564 is turned off, and the low -level is working.
The current limit logo
OPA564 has a current limit logo (IFLAG), which can monitor it to determine whether the load current is or or More than the current restrictions set by the user. Compatible with standard CMOS pin (IFLV and standard output compatibility). Compared to V,+0.8V, or lower voltage levels, indicating that the amplifier works in the restrictions set by the user settings. Compared to V,+2.0V, or higher voltage level, the operating voltage of OPA564 is higher than the current limit set by users. For the correct current limit operation, please refer to the setting current limit.
Output level compensation
The common complicated load impedance in the power operation amplifier application can cause output compensation circuits when the output level is unstable and normal. However, if OPA564 is driven to a current limit, R/C networks (buffer) may be required. When a large -driven capacitance load (greater than 1000PF) or perceptual load (for example, the buffer circuit as shown in Figure 54 can also improve stability as shown in Figure 54. Usually, 3 #8486; to 10 #8486;, 0.01mf to 0.1mf is enough. Some loads may require some changes in the circuit value. 
The output structure of OPA564 includes ESD diode (see Figure 43). The voltage of the OPA564 output shall not exceed 0.4V of any power rail to avoid damage to the device. The load that generates the powerless and electromagnetic field (EMF) can return the load current to the amplifier, causing the output voltage to exceed the power supply voltage. As shown in Figures 54 and Figure 55, clamp diode from the output terminal to the power supply can avoid this damage. It is recommended to use the continuous rated value of 3A or larger Schottky rectifier diode.
Thermal protection
OPA564 has armal sensing circuit, which helps protect the amplifier without exceeding the temperature limit. The power consumed in OPA564 leads to an increased temperature. When the mold temperature reaches the heat shutdown temperature limit, the internal heat shutdown circuit will be disabled. The OPA564 output is closed until the mold is fully cooled; see the electrical characteristics, the heat shutdown part. 
The internal protection circuit design of OPA564 is used to prevent overload; it is not used to replace appropriate continuous heat dissipation and run OPA564 heat clearance opportunities to reduce reliability.
Use TSENSE to measure the knot temperature
OPA564 includes an internal diode used for temperature monitoring. The H coefficient of the diode is 1.033. Measuring OPA564 knot temperature can be completed by connecting the TSENSE pin to the remote knot temperature sensor (such as TMP411) (see Figure 57).
Power consumption and safety operation area
Power consumption depends on power, signals and load conditions. For DC signals, the power dissipation space is equal to the output current (IOUT) and the voltage of the voltage on the transmission output transistor [(V+)-VOUT (source); the product of the time-(v-)]. The exchange signal is dispersed.
FIG. 45 shows the safety operation area under different heat dissipation power at room temperature. Please note that the safe output current decreases with the increase of (V+)-VOUT or Vout-(V-). Figure 46 shows the safety operation area at different temperatures, and the power board welded on a 2 ounce copper pad.
The power of safe heat dissipation in the packaging is related to environmental temperature and radiator design. PowerPad packaging is designed specifically for excellent power consumption, but the layout of the circuit board has greatly affected the heat dissipation of the packaging. For details, please refer to the hot enhanced PowerPad packaging part.
The relationship between thermal resistance and power consumption can be expressed as:
The combination of these equations will produce ]
In the formula:
tj u003d knot temperature (℃)
ta u003d ambient temperature (° C)qja u003d Block (° C/W)
pd u003d power consumption (w)
In order to determine the required heat dissipation tablet area, the power consumption required should be calculated, and the power consumption and heat should be considered and thermal heat should be considered. The relationship between resistance is to minimize the shutdown barPieces are allowed to work normally for a long time (the knot temperature does not exceed+85 ° C).
Once a heat dissipation area is selected, the load conditions should be tested in the worst case to ensure proper heat protection.
For applications with limited plate size, refer to Figure 47 to understand the approximate thermal resistance of the area of u200bu200bthe radiator. Increased the heat sink area OPA564 using HSOP-20 PowerPad DWP Beyond 2in2, the thermal resistance has hardly improved. In order to achieve 33 ° C/W shown in the electrical characteristics, the 2oz copper plane of 9in2 is used. According to the environmental temperature and heat dissipation area, PowerPad packaging is very suitable for continuous power levels from 2W to 4W. The increase in airflow also affects the maximum power consumption, as shown in Figure 48. In applications with low switching duty, such as remote meters, it can achieve higher power levels.
Thermal enhanced power board component
OPA564 uses HSOP-20 PowerPad DWP and DWD packaging. Essence These packaging greatly enhances power consumption capabilities. It can be easily installed with standard printing circuit board (PCB) assembly technology, and can be disassembled and replaced using standard maintenance procedures.
The design of DWP PowerPad packaging makes the lead frame chip pad (or hot pad) exposed to the bottom of the IC, as shown in Figure 49A; DWD PowerPad is packaged on the top of the packaging, as shown in the top of the packaging, as shown in Figure 49B Show. The thermal pad provides a very low thermal resistance (QJC) path package between the chip and the outside.
PowerPad packaging with exposed pads is designed to be directly welded and welded to PCB, and PCB is used as a heat sink. Texas Instruments does not recommend using PowerPad packaging without welding it to PCB, because there is risk of reducing thermal properties and mechanical properties. In addition, by using the heating holes, the bottom thermal pad can be directly connected to the power supply board or the special heat sink structure designed as PCB. The voltage potential of the power board should be the same as V -. Wilding the bottom PowerPad to PCB is always necessary, even if it is used for low power consumption. It provides necessary thermal connections and mechanical connections between the lead frame mold and PCB.
Pad-Up-PowerPad encapsulation should have appropriately designed heat sinks. Due to the diversity and flexibility of this type of radiator, other details should come from a specific manufacturer of the radiator.
The bottom power board assembly process at the bottom: 
2. Prepare PCB with top etching patterns, as shown in the Thermal Land Pattern Mechanical drawing. Both wires and thermal pads should be etched.
3. Place the proposed number of holes (or heating holes) in the hot pad area, such as the mechanical drawings of the accompanying hot pad pads. The diameter of these holes should be 13mils (.013in or 330.2mm). They remain very small, so that during the return welding, it is not a problem with the welded core of the hole. 
5. Connect all holes (including holes in the hot pad area and outside the pad area) to the same level as the V-voltage potential.
6. When connecting these holes to the internal plane, do not use a typical abdomen or wheel spoke connection method (as shown in Figure 50). The gastrointestinal connection has a high -thermal resistance connection, which helps to slow the heat transfer during the welding operation. This configuration makes it easier to weld the pores with a flat connection. However, in this application, low thermal resistance is the most effective heat transfer requirement. Therefore, the holes under the power board component should be connected to the internal plane and a complete connection around the entire electroplated hole.
7. The welding mask at the top should expose the packaging terminal and thermal pad pad area. The hot pad area should show a 13mil hole. The outside of the pad should cover 25 dense ears.
8. Apply welding balm on the exposed hot pad area and all packaging terminals.
9. After completing these preparation steps, PowerPad IC is simply placed in an appropriate position and runs welded welding operations as any standard surface paste component. The processing will cause the parts to be installed correctly.
Details on PowerPad software packages, including heat -building precautions and maintenance procedures.
Application circuit
The high output current and low power of OPA564 make it an ideal choice for driving laser diode and thermal refrigerator. Figure 51 shows an improved screaming current pump circuit.
Electric Power Line Communication
Electric Power Line Communication (PLC) application needs to perform a certain form of signal transmission on the existing AC power line. The commonly used technology that couples these modulation signals to the line is a signal converter. It usually needs a power amplifier to provide sufficient current and voltage level to drive todayVarious loads on the power line. A application of such an application is shown in Figure 52. OPA564 is used to drive the signal used in the frequency modulation scheme, such as FSK (frequency transfer key control) or OFDM (orthogonal frequency division) to transmit digital information through the power line. The power output capacity of OPA564 requires the current requirements of the transformer shown in the transformer shown in the diagram, and it is coupled to the AC power cord by coupling the power container. Circuit protection is usually required or required to prevent excessive line voltage or current surge damage power amplifier and active circuits in the application circuit.
The programmable power supply
FIG. 53 shows OPA333 used to control the ISET to adjust the current limit of OPA564.
FIG. 54 shows a basic motor speed drive, but does not include any control of motor speed. For applications that need to be well controlled by the speed of the motor, but do not require the speed meter control accuracy, the circuit in Figure 55 controls the motor drive by using current consumption feedback.
For more information about this circuit, please refer to the application announcement DC motor speed C controller: Control the DC motor (SBOA043) that controls A non -speed meter feedback, you can download it from the Ti website.
FIG. 56 shows two examples of generating signals for VDig. Figure 56A uses 1N4732A Zina to accurately VDig higher than V -4.7V. Figure 56B uses a high -pressure pressure regulator to export the VDIG voltage. Figure 58 shows a detailed power line communication circuit.