illustrate

The HSDL-3002 is a small single-enhanced model that provides a combination of logic and infrared interface signals over air, serial, half-duplex infrared data links, and (2) infrared remote control transmission 940nm, suitable for general purpose remote control applications. For infrared data communications, the HSDL-3002 provides flexibility for low-power airbag system applications as well as remote control applications, depending on the application circuit design circuit section outlined in the application. The transceiver is compliant with the IrDA Physical Layer Specification Version 9.6 1.4kbit/s to 115.2kbit /s and meets the IEC 825 Class 1 eye safety standard. The HSDL-3002 can be completely shut down for very low power consumption. In shutdown mode, the PIN diode will not work, thus generating no photocurrent even in very bright environments. Such features are ideal for battery powered handheld products.

feature

Guaranteed Temperature Performance, -20 to 70°C – Guaranteed Critical Parameters Over Temperature and Supply Voltage Low Power Consumption Small Module Size – Height: 2.70 mm – Width: 9.10 mm – Depth: 3.65 mm Typically Withstands >100 mVp-p Power Supplies Ripple VCC power supply 2.7 to 5.5 volts Integrated EMI shielding Designed for radiant windows IEC 825 Class 1 eye-safe IrDA data characteristics Fully compliant with IrDA Physical Layer Specification Version 1.4 From 9.6 kbit/s to 115.2 kbit/s – Excellent nose pair Nasal Surgery – Connection distances up to 50 cm TXD (IrDA), RXD (IrDA) and

PIN diode Low shutdown current (10mA typical) LED card in high position protection Remote control function High radiation intensity spectrum suitable for remote control receiver Typical connection distance of 6 m

application

Mobile Data Communication and Universal Remote Control – PDA – Cell Phone

Application Support Information

The application engineering group can help you with the HSDL-3002 infrared transceiver module.

notes:

1.R1 is used to optimize the performance of the 870nm LED, while R2 is the current limiting resistor for the 940nm RC LED.

2.CX1 must be placed within 0.7cm of HSDL-3002 for best noise immunity.

3. In environments with noisy power supplies, as shown in Figure 1, including CX2 can enhance power supply rejection.

notes:

4. In-band EI≤115.2kb/s.

5. A logic low is the impulse response. Depending on the pattern and intensity of the incident intensity, this condition will persist for a period of time.

6. In order to maintain low shutdown current, TXD needs to be driven high or low instead of being left floating. The remote control input should remain low.

Absolute Maximum Ratings for Devices with Ambient Thermal Resistance ≤ 50°C/W

Electrical and Optical Specifications

Specifications (min and max) are maintained at recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere within its operating range. All typical values (typ) are at 25°C with VCC set to 3.0 V unless otherwise noted.

notes:

7. The in-band optical signal is a pulse/sequence, and its peak wavelength λp is defined as 850nm≤λp≤900nm, and the pulse characteristic is in line with the IrDA serial infrared physical layer link specification.

8. For in-band signals 2.4 kbps to 115.2 kbps, where 3.6 μW/cm~2≤EI≤500 mW/cm~2.

9. Latency is the time from the last TXD optical output pulse until the receiver returns to full sensitivity.

10. Receiver wake-up time is the time from VCC power-up to valid RXD output.

11. Transmitter wake-up time is the time from VCC power-up to valid light output in response to the TXD pulse.

12. The optical pulse width is defined as the maximum time for the LED to be on, this is to prevent the LED from being on for a long time.

13. When used with RCI, VIH and VIL depend on the switching transistor used and should be obtained from the transistor datasheet.

The reflow profile is a straight line representing the temperature profile of a nominal a convection reflow process. The temperature profile was divided into four processing zones at different temporal temperature change rates. Please refer to the table above for time and price. The temperature is measured at the component printed circuit board connection. In process zone P1, the PC board and HSDL-3602 castellation I/O pins are heated to an activation temperature of 125°C with flux in solder paste. The heating rate R1 is limited to 4°C per second to allow both computers to evenly heat the board and the HSDL-3602 cellular I/O pins. Process area P2 should be of sufficient duration (>60 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, typically 170°C (338°F). Process area P3 is a solder reflow area. The temperature rises rapidly above the solder liquidus in the P3 zone to achieve optimum temperature results of 230°C (446°F). The dwell time above the liquidus point of the solder should be between 15 and 90 seconds. It usually takes 15 seconds to ensure that the solder balls are soldered into liquid solder with a good solder forming connection. Beyond the dwell time of 90 seconds, the intermetallic solder grows excessively within the connection, resulting in the formation of weak and unreliable connections. This temperature is then quickly reduced to the solid state temperature of the solder, typically 170°C (338°F), to allow the solder at the connection to freeze solid. The process area P4 is the cold area where the solder freezes and drops. The cooling rate R5, 25°C (77°F) from the liquidus point of the solder should not exceed - at most 3°C per second. This limitation is necessary for the PC board and the HSDL-3602 to change the cellular I/O pin size to be uniform, placing minimal stress on the HSDL-3602 transceiver.

1.2 Recommended metal solder

It is recommended that the opening of the steel plate is only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick solder paste stencil printing. This is to ensure adequate volume of printed solder paste and no shorts. See the table below on the drawing for the combined aperture of the metal formwork and the thickness of the metal formwork that should be used. The cutouts are in a 3.05 mm x 1.1 mm (by land) pattern.

1.3 Adjacent Land Prohibition and Solder Mask Area The land adjacent to the area is the unit pattern that occupies the largest space relative to the land. There should be no other SMD component areas. The minimum solder mask width required to avoid soldering bridges adjacent pads is 0.2 mm. It is recommended that the two datum intersections should be placed in the middle of the device pad for alignment. Note: Wet/Liquid Photo Imageable Solder Mask/Mask Recommended.

printed circuit board layout

The suggestion below is an example that will result in good electrical and electromagnetic performance. Notes: 1. The ground plane should be continuous under the part, but should not extend to the shield trace. 2. The shield traces are wide and low inductance traced back to the system ground. 3. The AGND pin should be connected to the ground plane, not the shield label. 4.C1 and C2 are optional power supply filter capacitors; they can be used if the power supply is clean. 5.VLED can be connected to unfiltered or unfiltered power supply. If VLEDVCC has the same power supply and C1 is used the connection should be in current limiting resistor R2. In noisy environments, power rejection can be good by including C2. Layout and follow application circuit diagrams.

R2 is the current limiting resistor, while R1 is an input resistive switching transistor with a weak pull-down. Do not float switch input MOSFETs. Use DIP switches to drive 875nm or 940nm LEDs.

Overview Application Guide

HSDL-3002 Infrared Infrared Infrared Infrared Compliant 115.2 Kb/s Transceiver

illustrate

HSDL-3002, Wide Voltage Infrared Operating Range Transceiver is low cost and small device, that is designed for mobile computing market, such as PDA, and small embedded mobile devices such as digital cameras and mobile phones. It also includes a 940nm LED to support universal remote control applications. Fully compliant with the IrDA 1.4 low power specification, from 9.6 kb/s to 115.2 kb/s, supporting most remote control codes. The high-speed digital library design-3002 also includes the following unique features: An additional spectral fit for 940nm LEDs with a low number of passive components. Low power shutdown mode consumption requirements. Selection of Resistor R1 Resistor R1 should be selected to provide the proper peak pulse LED current over the range of VCC as shown in the table below.

Resistor values were chosen above to optimize IrDA operation. For optimal remote control performance, it is recommended to turn on the 870nm and 940nm LEDs. Furthermore, independent power control functions can be incorporated for remote control operations by implementing the device, as shown in Figure 3. Interface with recommended I/O chip HSDL-3002's TXD data input buffer to allow CMOS drive level. No peaking circuits or capacitors required. Data rates from 9.6 kb/s to 115.2 kb/s are available from the RXD pin. The V(RC), pin 2, along with TxD (IrDA), pin 3, can be used to send remote control codes. Pin 2 drives a transistor with an extremely low on-resistance through a switching FET, capable of driving 400 mA of remote control current for operation. The block diagram below shows how the IrDA port interacts with cell phone and PDA platforms.

Link distance testing is done using a typical HSDL-3002 with National Semiconductor PC87109 3 V Super device I/O controller and SMCFDC37C669 and FDC37N769 Super I/O controllers. Connection distances up to 100 cm are demonstrated. The Remote Operated HSDL-3002 comes with additional spectrally matched remote control 940nm LED applications. The remote control app is not subject to any standard control codes there are many remotes on the market. Each of these criteria results in different receiver module sensitivities, depending on the carrier frequency and wavelength of response to incident light. According to some commonly used remote control receiver modules, the irradiance was found to be in the range of 0.05~0.07 microwatts/square centimeter. Based on a typical irradiance of 0.075 μW/cm2, with 870 nm 940 nm LEDs turned on, the typical link distance reaches 6 meters. For a more detailed description of implementing remote control using the HSDL-3002, please refer to the application description.

window design

Optical Port Dimensions for HSDL-3002 Model HSDL-3002 To ensure IrDA compliance, some heights and widths of windows exist. This minimum size ensures compliance with the IrDA taper angle without vignette. The maximum size minimizes the effect of stray light. The smallest dimension corresponds to 30° and the largest dimension corresponds to a taper angle of 60 degrees. In the image below, X is the width of the window, the height is the window and Z is the distance from the HSDL-3002 to the back on the window. The distance from the center of the LED lens to the center of the photodiode lens, K, is 5.8 mm. The system of equations calculates the window size as follows: X=K+2*(Z+D)Y=2*(Z+D)*Tana The above equation assumes that the thickness of the window is the same as that of the module and behind the window (Z). If they are comparable, Z' replaces Z in the equation above. Z' is defined as Z'=Z+t/n where "t" is the window and "n" is the refractive index window material index. The depth of the LED image in the HSDL-3002, D, is 8.6 mm. "A" is the desired half angle of view. For Adidas compliance, min 15' max 30°. Assuming the windows are negligible, the equation results in the following table and graph:

The shape of the window The window should be flat from an optical point of view. This ensures that the window does not change the radiating mode or the receiving mode of the photodiode. If the window must be curved for mechanical or industrial design reasons, do the same curve for the back radius of the window as for the front. But this won't completely remove the effect of the front surface of the lens, it will greatly reduce it. The variable amount of radiation pattern depends on the material selected for the flat window (preferred) window, the radius of the front of the back curve and the distance from the back surface to the transceiver. Once these items are known, the lens design can be such that it can remove the effect of the front curve curve. The image below shows the surface window pair radiation pattern. The center thickness of the window is 1.5mm in all cases, the window is made of polycarbonate plastic, and the back of the window from the transceiver to the window is 3mm.