illustrate

The HSDL-3003 is a small factor enhanced infrared (IR) providing (1) interface capability between logic and IR signals via air, serial, half-duplex IR data link and (2) IR remote control transmission in Best 940nm wavelength universal remote control application. For infrared data communication the HSDL-3003 provides the flexibility of low power SIR applications and remote control applications without the choice of component types required for external applications. Transceivers are IrDA 174 compliant; physical

IrDA® Data Capabilities

Fully compliant with IrDA® Physical Layer Specification 1.4 Low power from 9.6 kbit/s to 115.2 kbit/s (airbag system) – Excellent nose to nose surgery – Connection distance up to 50 cm Usually TxD_IrDA fully off, RxDúu IrDA and PIN diode low power Power Consumption – Low idle current, 50µA typical – Low shutdown current, 10mA typical LED stuck high protection

application

Mobile Data Communication and Universal Remote Control Transmission – Personal Digital Assistants (PDAs) – Cell Phones

General Features

Guaranteed temperature performance, –20° to 70°C – key parameters are guaranteed ultra-temperature and supply voltage low power consumption Small module size – Height: 2.70 mm – Width: 8.00 mm – Depth: 2.95 mm Minimum external components – Integrated single bias LED Resistors – Direct interoperability with MPU – Programmable Txd function – Integrated remote control FET can withstand more than 100 mVp -p power supply ripple VCC supply 2.4 to 3.6 volts Eye safety remote control function Wide angle high radiation intensity suitable for remote control transmission function Typical 940nm Typical link distance up to 8 meters HSDL-3003 idle speed is very low current and can be shut down completely to achieve very low power consumption. In off mode, the PIN diodes will be inactive, thus producing very little photocurrent even in very bright environments. These features are ideal for battery-operated handheld products such as PDAs and cell phones.

notes:

1.CX1 must be placed within 0.7cm of HSDL-3003 for best noise immunity.

2. As shown in Figure 1, in an environment with large power supply noise.

The configuration of different remote control HSDL-3003 HSDL-3003 can be in single TXD programmable mode or two TXD direct transmission mode. Single TXD Programmable Mode Programmable mode in a single TXD, only one input pin (TxD_IrDA input pin) is used to turn on 875 nm LED or 940 nm LED TxD_RC input pin is grounded. The transceiver is in default mode (IrDA) when powered up. The user needs to apply the following programming sequence to both TxD and U IrDA and SD inputs to make the transceiver work in IrDA or remote control mode.

Two TXD Direct Transmission Modes In the two TXD direct transmission modes, the 875nm LED and 940nm LED are turned on by two separate input pins. This IrDA input pin is used to turn on the 875nm LED, while the TxD-u RC input pin is used to turn on the 940nm LED.

Absolute Maximum Ratings at TA=25°C for devices with ambient thermal resistance ≤ 50°C/W

Electrical and Optical Specifications

Specifications (minimum and maximum values) are maintained at recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere within its operating range. All typical values (typ) are at 25°C with VCC at 3.0V unless otherwise noted.

notes:

3. The in-band optical signal is a pulse/sequence, and its peak wavelength λP is defined as 850nm≤λP≤900nm, and the pulse characteristics conform to the IrDA serial infrared physical layer link specification version 1.4.

4. For in-band signals 9.6 kbit/s to 115.2 kbit/s, where 9 μW/cm~2≤EI≤500 mW/cm~2.

5. Latency is defined as the time from the last TxD_IrDA optical output pulse until the receiver fully regains sensitivity.

6. Receiver wake-up time is the time from VCC power up to valid RxD_IrDA output.

7. Transmitter wake-up time is measured from VCC power-up to valid light output in response to TxD_IrDA pulses.

8. The optical pulse width is defined as the maximum time that the IrDA/RC LED is turned on, this is to prevent the IrDA and RC LEDs.

9. This limit is a production test limit.

The reflow profile is a straight line that represents the temperature distribution for a nominal vector reflow process. The temperature profile was divided into four processing zones at different temporal temperature change rates. Measure the temperature at the board connection at the component to be printed. In process zone P1, the PC board and I/O pins are heated to a temperature of 160°C to activate the flux in the solder paste. The air temperature rise rate R1 is limited to 4°C / The second is to heat the PC board evenly and the HSDL-3003 input/output pins. Process zone P2 should be of sufficient duration (60 to –120 seconds) to dry the solder paste. The temperature rises slightly below the liquidus of the solder joint, typically 200 degrees Celsius (392 degrees Fahrenheit). Process area P3 is a solder reflow area. The temperature in the P3 zone is rapidly raised above the solder liquidus to 255°C (491°F) for best results. The dwell time above the liquidus point of the solder should be between 20 and 60 seconds. It usually takes 20 seconds to ensure that the balls are soldered into liquid solder with a good solder forming connection. Beyond the dwell time of 60 seconds, the intermetallic solder grows excessively within the connection, resulting in the formation of weak and unreliable connections. This temperature is then quickly reduced to the solid state temperature of the solder, typically 200°C (392°F), to allow the solder at the connection to freeze solid. The process area P4 is the cold area where the solder freezes and drops. Cool drop rate from liquidus R5 solder point to 25°C (77°F) should not exceed -6°C second maximum. This limitation must allow the PC board and transceiver's cellular I/O pins to change size evenly, minimizing stress on the HSDL-3003.

PCB Layout Recommendations

The following PCB layout should follow the following guidelines for good PSRR and EM immunity and good electrical performance. Things to note: 1. The ground plane should be continuous under the part, but should not extend to the shield trace. 2. The shield traces are wide and low inductance traced back to the system ground. CX1, CX2 and h3c are optional power filter capacitors if using a clean power supply. 3.VLED can be connected to unfiltered or unregulated power supply. If VLED and Vcc share the same power supply, the connection of CX1 and CX2 should not be used and should be limited by resistor R1 before the current. In noisy environments, including capacitor CX2 can enhance the rejection of supply. CX1 is generally a ceramic capacitor with low inductance providing a wide frequency response CX2 and CX3 are tantalum bulk capacitors with a fast frequency response. This using a tantalum capacitor is more important on the VLED line, which draws a lot of current. 4. Preferably a multi-layered board should be accustomed to provide enough ground for the plane. Use the layer below and near the transceiver module for Vcc, and sandwich that layer to the ground plane layer. The reference diagram below is a four-layer board.

The area below the module is on the second floor, 3 cm in all directions of the entire module, and is defined as the critical point plane area. The ground plane should be maximized in this area. See Application Note AN1114 or the Agilent IrDA Data Link Detailed Design Guide for a top view. This layout below is based on a two-layer printed circuit board.

General application

HSDL-3003 Infrared Guidelines for IrDA® Compliant 115.2 Kb/s Transceivers

illustrate

HSDL-3003, Wide Voltage Infrared Operating Range Transceiver Low cost, small form factor device designed to address markets such as mobile computing PDAs, as well as small embedded mobile products such as digital cameras and cell phones. It is ghostly suitable for universal remote control 940nm transmission function usually. It fully complies with the IrDA 1.4 low power specification from 9.6 kb/s to 115.2 kb/s, and supports most remote control codes. The high-speed digital library design-3003 also includes the following unique features: Suitable for general purpose remote control transmission typically operating at 940nm. Low number of passive components. Low power shutdown mode consumption requirements. Selection of Resistor R1 Resistor R1 should be selected to provide an appropriate range of peak pulsed LED current Vcc as shown on page 3 under "Recommended Applications" Circuit Components". Interface with Recommended I/O Chip TXD Data Input of HSDL-3003 Buffered to allow CMOS drive levels. No peaking circuitry or capacitors required. Data rates from 9.6 kb/s to 115.2 kb/s are available from the RXD pin. The TXD_RC (pin 7) or remote can be sent using TXD_IrDA (pin 3) Code. The block diagram below shows how the IrDA port interacts with cell phone and PDA platforms

Link distance testing is done using a typical HSDL-3003 unit with SMC FDC37C669 and FDC37N769 Super I/O Controller. IrDA link distances up to 70 cm. Remote control operation The HSDL-3003 is spectrally suitable for the transmission function of universal remote control at 940nm. The remote control app is not subject to any standard control codes there are many remotes on the market. Each standard results in different receiver module sensitivities, depending on the carrier frequency and wavelength of response to incident light. According to some common remote control receiver modules, the irradiance is found to be 0.05~0.07mw/cm~2. Based on typical irradiances of 0.05mw/cm2 and 0.075mw/cm2 and turning on the RC LEDs, a typical connection distance of 8 m and 7 m is typically achieved.