Please believe that a complete 5G system includes three main functions: eMBB (enhanced mobile broadband), URLLC (ultra-reliable low-latency communication) and mMTC (massive machine type communication). The characteristics of DECT-2020NR provide a good solution to the challenges posed by URLLC and mMTC, which is why the ITU prefers this standard. DECT-2020NR is ...
Read moreCPU, GPU, FPGA, high-performance analog chips. In the future, with the continuous expansion of production capacity, South Asia is expected to be overloaded and become the fourth largest DRAM chip maker in the world. Shenwei and others are the representative manufacturers of domestic CPUs. Shenwei and others are the representative manufacturers of domestic CPUs. In general...
Read moreproduct detailed information describe: The DRV8212P is an integrated motor driver with four N-channel power FETs, AP6503SP-13 charge pump regulator and protection circuitry. The triple charge pump architecture allows the device to operate down to 1.65V to accommodate 1.8V rails and low battery conditions. The charge pump integrates all capacitors to reduce the overall solution siz...
Read moreThe ambient light sensor under Goodix technology helps Xiaomi 12Pro increase the screen ratio. TMD3719 is the first ambient light sensor, which can be applied under the screen design. There are 6 kinds of ambient light and color-sensitive channels, while AMS is equipped with UV/IR barrier filters for RGBL (color gamut) and transparent channels, respectively. The sensor is also ...
Read moreRecently, XMEMS Laboratories introduced Tomales, a scalable single-chip MEMS piezoelectric driver tweeter. According to reports, the MEMS micro-speaker can achieve large audio coverage from 20Hz to 20kHz, and has the characteristics of small size, light weight, low power consumption, and strong scalability, which can meet the application of small products such as TWS headphon...
Read moreIn recent years, the commercialization of third-generation semiconductor devices such as Gan and SiC has progressed well. While third-generation semiconductors are making progress on the road to commercialization, fourth-generation semiconductor materials have also made great strides. Compared with silicon-based and third-generation semiconductor materials, ultra-wide bandgap materials have ...
Read moreProduct Details describe: The OPA182 , OPA2182, and OPA4182 (OPAx182) are the AQY214EHAX precision operational amplifiers in ultralow noise, fast settling, zero-drift devices that provide rail-to-rail output operation with a unique MUX-friendly architecture and controlled startup system. These features and excellent AC performance, combined with an offset voltage of onl...
Read moreXRM32UL051 is an ARMCortex-based ultra-low power consumption MCU chip based on ARMCortex-M0, the highest operating frequency can reach 48MHz , the highest operating frequency can reach 64KB program space and 18KBSRAM storage space. ULPMark, as the authoritative standard of ultra-low power consumption MCU, affirms the ultra-low power consumption technology of Zhon...
Read moreproduct detailed information describe: The TCAN1046AV-Q1 and TCAN1048AV-Q1 (TCAN104xAV-Q1) are dual-channel high-speed controller area network (CAN) transceivers that meet the physical layer requirements of the ISO 11898-2: 2016 high-speed CAN specification. The TCAN104xAV-Q1 transceivers support classic CAN and CAN FD networks up to 8 megabits per se...
Read moreOn this laptop, it can be seen from the promotional pictures that the Kaitian N70Z/N79Z uses the Zhaoxin KX6640MA, and the General KX6640MA is a quad-core processor with a maximum frequency of 26GHz and a built-in 16GB model">16GB model"> 16GB Model">16GB Model">16GB Model">16GB Model">16GB Model">16GB Model">16GB Model">16GB Model">16GB Model">16G...
Read moreWith the development of 5g technology and artificial intelligence, as well as the trend of automobile intelligence, the demand for 5g radio frequency, PC, fingerprint recognition, car control, sensors and other chips is also growing rapidly. However, with the resumption of work, the rebound in car sales, and the increase in various demands, the pressure on the wafer factory has been transferre...
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